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633 products
The focus-tool accessory, allows any FLIR Boson lens which cannot be focused by hand to be focused by engaging the appropriate slots on the lens barrel such that it can be rotated inside the lens flange. (The focus tool has been properly sized such that no vignetting results when it engages the slots on the lens barrel.) Note that lens configurations with focal length >25mm do not require a focus tool since focus is achieved by simply turning the outer barrel of the lens assembly by hand.
This product is NOT compatible with the following FLIR Boson Thermal Imagers:
Teledyne FLIR Boson MIPI Development Accessory Board
Take your imaging projects to the next level with the Teledyne FLIR MIPI Development Accessory Board. Featuring support for pixel formats like RAW8, 16-bit UYVY, and RAW14, this board offers unparalleled flexibility for your thermal imaging needs.
Whether you're working in single channel mode or dual channel mode, this accessory board provides incredible image quality and clarity. And with a lightning-fast MIPI DDR clock rate of 246 MHz and a latency under 4.8ms, you can count on this board for seamless image processing.
FLIR Boson SX8 - 12mm Lens
1280 × 1024 Resolution, 8-micron, SWaP-Optimized LWIR Camera Module
Boson® SX8 is the world’s first high-volume production, ITAR-free and NDAA-compliant uncooled longwave infrared (LWIR) camera module to deliver SXGA (1280 × 1024) resolution with an 8-micron (µm) pixel-pitch microbolometer. Engineered to minimize size, weight, and power (SWaP), Boson SX8 improves situational awareness in a compact, integration-ready form factor. Purpose-built for industrial, commercial, and defense integrations, Boson SX8 delivers 4× more pixels than a 640 × 512 VGA module, extending detection, recognition, and identification (DRI) range and providing clear imagery at long distances.
Multiple lens options, including a factory integrated continuous zoom lens, support a wide range of platforms, from uncrewed systems and counter-UAS to seekers, perimeter security, visual augmentation, and handheld devices. With high-speed performance and SXGA output, Boson SX8 helps operators see more, see farther, and do more. Boson SX8 helps accelerate development and reduce integration risk with an available graphical user interface (GUI), germanium-free lens configurations, and compatibility with Teledyne FLIR OEM’s Prism™ intelligent digital products. Manufactured at scale in the USA, it offers lower supply-chain risk, high reliability, and world-class support from a trusted volume supplier—setting a new standard for SWaP-optimized thermal imaging.
High-performance 1280 × 1024 clarity in a SWaP-optimized package
- New SWaP-optimized 8 µm pixel pitch
- Market-leading 1280 × 1024 (SXGA) resolution
- 30 Hz and 60 Hz with roadmap to higher frame-rate options
Integration-ready design that is AI-ready
- Boson SX8 GUI available
- Multiple lens options, including Ge-free models
- Compatible with intelligent Prism digital products
- Compact, factory-integrated CZ lens option
A trusted development partner and low-risk volume supplier
- World-class support and service
- ITAR-free and NDAA-compliant
- High-volume manufacturing in the USA
- Classified under U.S. Department of Commerce jurisdiction as EAR 6A003.b.4.b
FLIR Boson SX8 - 18mm Lens
1280 × 1024 Resolution, 8-micron, SWaP-Optimized LWIR Camera Module
Boson® SX8 is the world’s first high-volume production, ITAR-free and NDAA-compliant uncooled longwave infrared (LWIR) camera module to deliver SXGA (1280 × 1024) resolution with an 8-micron (µm) pixel-pitch microbolometer. Engineered to minimize size, weight, and power (SWaP), Boson SX8 improves situational awareness in a compact, integration-ready form factor. Purpose-built for industrial, commercial, and defense integrations, Boson SX8 delivers 4× more pixels than a 640 × 512 VGA module, extending detection, recognition, and identification (DRI) range and providing clear imagery at long distances.
Multiple lens options, including a factory integrated continuous zoom lens, support a wide range of platforms, from uncrewed systems and counter-UAS to seekers, perimeter security, visual augmentation, and handheld devices. With high-speed performance and SXGA output, Boson SX8 helps operators see more, see farther, and do more. Boson SX8 helps accelerate development and reduce integration risk with an available graphical user interface (GUI), germanium-free lens configurations, and compatibility with Teledyne FLIR OEM’s Prism™ intelligent digital products. Manufactured at scale in the USA, it offers lower supply-chain risk, high reliability, and world-class support from a trusted volume supplier—setting a new standard for SWaP-optimized thermal imaging.
High-performance 1280 × 1024 clarity in a SWaP-optimized package
- New SWaP-optimized 8 µm pixel pitch
- Market-leading 1280 × 1024 (SXGA) resolution
- 30 Hz and 60 Hz with roadmap to higher frame-rate options
Integration-ready design that is AI-ready
- Boson SX8 GUI available
- Multiple lens options, including Ge-free models
- Compatible with intelligent Prism digital products
- Compact, factory-integrated CZ lens option
A trusted development partner and low-risk volume supplier
- World-class support and service
- ITAR-free and NDAA-compliant
- High-volume manufacturing in the USA
- Classified under U.S. Department of Commerce jurisdiction as EAR 6A003.b.4.b
FLIR Boson SX8 - 24mm Lens
1280 × 1024 Resolution, 8-micron, SWaP-Optimized LWIR Camera Module
Boson® SX8 is the world’s first high-volume production, ITAR-free and NDAA-compliant uncooled longwave infrared (LWIR) camera module to deliver SXGA (1280 × 1024) resolution with an 8-micron (µm) pixel-pitch microbolometer. Engineered to minimize size, weight, and power (SWaP), Boson SX8 improves situational awareness in a compact, integration-ready form factor. Purpose-built for industrial, commercial, and defense integrations, Boson SX8 delivers 4× more pixels than a 640 × 512 VGA module, extending detection, recognition, and identification (DRI) range and providing clear imagery at long distances.
Multiple lens options, including a factory integrated continuous zoom lens, support a wide range of platforms, from uncrewed systems and counter-UAS to seekers, perimeter security, visual augmentation, and handheld devices. With high-speed performance and SXGA output, Boson SX8 helps operators see more, see farther, and do more. Boson SX8 helps accelerate development and reduce integration risk with an available graphical user interface (GUI), germanium-free lens configurations, and compatibility with Teledyne FLIR OEM’s Prism™ intelligent digital products. Manufactured at scale in the USA, it offers lower supply-chain risk, high reliability, and world-class support from a trusted volume supplier—setting a new standard for SWaP-optimized thermal imaging.
High-performance 1280 × 1024 clarity in a SWaP-optimized package
- New SWaP-optimized 8 µm pixel pitch
- Market-leading 1280 × 1024 (SXGA) resolution
- 30 Hz and 60 Hz with roadmap to higher frame-rate options
Integration-ready design that is AI-ready
- Boson SX8 GUI available
- Multiple lens options, including Ge-free models
- Compatible with intelligent Prism digital products
- Compact, factory-integrated CZ lens option
A trusted development partner and low-risk volume supplier
- World-class support and service
- ITAR-free and NDAA-compliant
- High-volume manufacturing in the USA
- Classified under U.S. Department of Commerce jurisdiction as EAR 6A003.b.4.b
Boson Tripod Mount
The Tripod-mount accessory, provides a means to mount a Boson assembly (or a Boson configured with either the VPC Accessory or the Camera Link Accessory) to a tripod via a standard 1/4-20 thread. It is designed to interface to the rear of the Boson via 4 x M1.6 screws.
Boson VPC Accessory
For the FLIR Boson Thermal Imaging Cameras
The Boson video/power/control (VPC) is an accessory that adapts the native high-density electrical connector to a simpler USB-C interface. The Kit includes a VPC adapter, and a USB-C to USB-A cable.
Boson VPC Accessory w/ Analog
For the FLIR Boson Thermal Imaging Cameras
The Boson video/power/control (VPC) is an accessory that adapts the native high-density electrical connector to a simpler USB-C interface.
The Kit includes a VPC adapter, as well as a bifurcated cable with USB-A (power/control) and BNC (video) connectors.
Teledyne FLIR BOSON+ 320 x 256 13.8mm 16° HFoV - LWIR Thermal Camera Core**
From $2,525.00
Unit price perTeledyne FLIR BOSON+ 320 x 256 13.8mm 16° HFoV - LWIR Thermal Camera Core**
From $2,525.00
Unit price perFLIR Boson+ - 13.8mm Lens
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY
Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.
- ≤20 mK thermal sensitivity
- Improved latency for faster decision support
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Low power consumption, starting at 900 mW
- Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
- Rugged construction and operating temperature rating of -40 °C to 80 °C
DESIGNED FOR INTEGRATORS
Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.
- Comprehensive product integration documentation and easy-to-use Boson GUI.
- Highly qualified Technical Services team available to support integration
- Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
- Flexible USB and CMOS or USB and MIPI interface
Teledyne FLIR BOSON+ 320 x 256 18mm 12° HFoV - LWIR Thermal Camera Core
From $3,366.00
Unit price perTeledyne FLIR BOSON+ 320 x 256 18mm 12° HFoV - LWIR Thermal Camera Core
From $3,366.00
Unit price perFLIR Boson+ - 18mm Lens
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to ≤20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY
Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.
- ≤20 mK thermal sensitivity
- Improved latency for faster decision support
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Low power consumption, starting at 900 mW
- Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
- Rugged construction and operating temperature rating of -40 °C to 80 °C
DESIGNED FOR INTEGRATORS
Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.
- Comprehensive product integration documentation and easy-to-use Boson GUI.
- Highly qualified Technical Services team available to support integration
- Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
- Flexible USB and CMOS or USB and MIPI interface
Teledyne FLIR BOSON+ 320 x 256 2.3mm 92° HFoV - LWIR Thermal Camera Core
From $2,525.00
Unit price perTeledyne FLIR BOSON+ 320 x 256 2.3mm 92° HFoV - LWIR Thermal Camera Core
From $2,525.00
Unit price perFLIR Boson+ - 2.3mm Lens
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY
Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.
- ≤20 mK thermal sensitivity
- Improved latency for faster decision support
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Low power consumption, starting at 900 mW
- Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
- Rugged construction and operating temperature rating of -40 °C to 80 °C
DESIGNED FOR INTEGRATORS
Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.
- Comprehensive product integration documentation and easy-to-use Boson GUI.
- Highly qualified Technical Services team available to support integration
- Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
- Flexible USB and CMOS or USB and MIPI interface
Teledyne FLIR BOSON+ 320 x 256 2.3mm 92° HFoV - Radiometric - LWIR Thermal Camera Core
From $2,628.00
Unit price perTeledyne FLIR BOSON+ 320 x 256 2.3mm 92° HFoV - Radiometric - LWIR Thermal Camera Core
From $2,628.00
Unit price perFLIR Boson+ - 2.3mm Lens Radiometric
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
Your Application, Now With Radiometry.
Why Radiometry?
There are times when a simple thermal image is not enough to interpret a scene. In these scenarios, the ability to detect and record the temperature data from every pixel is vital to the task at hand. Radiometric thermal cameras measure the intensity of infrared signals reaching the camera to provide an accurate temperature reading of objects in the scene.
Built-In Spot Meter Accuracy
Boson Radiometric cameras include a Spot Meter Accuracy software feature that provides an assessment of how accurate a given temperature measurement appears in the scene. Available as telemetry data accessed through the Boson SDK or the Boson graphical user interface (GUI), this feature provides guidance across five confidence grades, offering in-the-moment assessment to help improve temperature measurement confidence.
ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY
Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.
- ≤20 mK thermal sensitivity
- Improved latency for faster decision support
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Low power consumption, starting at 900 mW
- Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
- Rugged construction and operating temperature rating of -40 °C to 80 °C
DESIGNED FOR INTEGRATORS
Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.
- Comprehensive product integration documentation and easy-to-use Boson GUI.
- Highly qualified Technical Services team available to support integration
- Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
- Flexible USB and CMOS or USB and MIPI interface
Teledyne FLIR BOSON+ 320 x 256 36mm 6.1° HFoV - LWIR Thermal Camera Core
From $3,366.00
Unit price perTeledyne FLIR BOSON+ 320 x 256 36mm 6.1° HFoV - LWIR Thermal Camera Core
From $3,366.00
Unit price perFLIR Boson+ - 36mm Lens
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY
Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.
- ≤20 mK thermal sensitivity
- Improved latency for faster decision support
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Low power consumption, starting at 900 mW
- Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
- Rugged construction and operating temperature rating of -40 °C to 80 °C
DESIGNED FOR INTEGRATORS
Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.
- Comprehensive product integration documentation and easy-to-use Boson GUI.
- Highly qualified Technical Services team available to support integration
- Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
- Flexible USB and CMOS or USB and MIPI interface
Teledyne FLIR BOSON+ 320 x 256 4.3mm 50° HFoV - LWIR Thermal Camera Core
From $2,525.00
Unit price perTeledyne FLIR BOSON+ 320 x 256 4.3mm 50° HFoV - LWIR Thermal Camera Core
From $2,525.00
Unit price perFLIR Boson+ 320 - 4.3mm Lens
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY
Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.
- ≤20 mK thermal sensitivity
- Improved latency for faster decision support
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Low power consumption, starting at 900 mW
- Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
- Rugged construction and operating temperature rating of -40 °C to 80 °C
DESIGNED FOR INTEGRATORS
Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.
- Comprehensive product integration documentation and easy-to-use Boson GUI.
- Highly qualified Technical Services team available to support integration
- Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
- Flexible USB and CMOS or USB and MIPI interface
Teledyne FLIR BOSON+ 320 x 256 4.5mm 50° HFoV - Radiometric Short Lens LWIR Thermal Camera Core
From $2,628.00
Unit price perTeledyne FLIR BOSON+ 320 x 256 4.5mm 50° HFoV - Radiometric Short Lens LWIR Thermal Camera Core
From $2,628.00
Unit price perFLIR Boson+ 320 - 4.5mm Short Lens
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
Your Application, Now With Radiometry.
Why Radiometry?
There are times when a simple thermal image is not enough to interpret a scene. In these scenarios, the ability to detect and record the temperature data from every pixel is vital to the task at hand. Radiometric thermal cameras measure the intensity of infrared signals reaching the camera to provide an accurate temperature reading of objects in the scene.
Built-In Spot Meter Accuracy
Boson Radiometric cameras include a Spot Meter Accuracy software feature that provides an assessment of how accurate a given temperature measurement appears in the scene. Available as telemetry data accessed through the Boson SDK or the Boson graphical user interface (GUI), this feature provides guidance across five confidence grades, offering in-the-moment assessment to help improve temperature measurement confidence.
ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY
Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.
- ≤20 mK thermal sensitivity
- Improved latency for faster decision support
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Low power consumption, starting at 900 mW
- Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
- Rugged construction and operating temperature rating of -40 °C to 80 °C
DESIGNED FOR INTEGRATORS
Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.
- Comprehensive product integration documentation and easy-to-use Boson GUI.
- Highly qualified Technical Services team available to support integration
- Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
- Flexible USB and CMOS or USB and MIPI interface