Products

Camera Link Accessory Kit

For the FLIR Boson Thermal Imaging Cameras

Expansion board for Boson cameras that matches the functionality of the VPC module, and enables the camera to be interfaced to a Camera Link frame grabber, allowing the capture of digital 16-bit video data.

(This product does not include Camera Link cable, frame grab board, or data capture software.)

Boson Test Board, Detail PCB ASSEMBLY

Boson Development Board

The Development breakout board for Boson users and integrators that need easy access to the Boson I/O and interfaces. This board is intended for user development purposes, and is not intended or rated for long term reliability over temperature.

It provides full access to the Boson 80-pin connector with a number of connectors:

• standard USB-3 micro-B (Super Speed) receptacle
• standard SDR-26 receptacle with Camera-Link compliant output
• SDIO card slot
• UART header
• I²C header
• SPI header
• Power jacks

The focus-tool accessory, allows any FLIR Boson lens which cannot be focused by hand to be focused by engaging the appropriate slots on the lens barrel such that it can be rotated inside the lens flange. (The focus tool has been properly sized such that no vignetting results when it engages the slots on the lens barrel.) Note that lens configurations with focal length >25mm do not require a focus tool since focus is achieved by simply turning the outer barrel of the lens assembly by hand.

Compatible With the Following: 

Take your imaging projects to the next level with the Teledyne FLIR MIPI Development Accessory Board. Featuring support for pixel formats like RAW8, 16-bit UYVY, and RAW14, this board offers unparalleled flexibility for your thermal imaging needs.

Whether you're working in single channel mode or dual channel mode, this accessory board provides incredible image quality and clarity. And with a lightning-fast MIPI DDR clock rate of 246 MHz and a latency under 4.8ms, you can count on this board for seamless image processing.

FLIR Boson SX8 - 12mm Lens

1280 × 1024 Resolution, 8-micron, SWaP-Optimized LWIR Camera Module

Boson® SX8 is the world’s first high-volume production, ITAR-free and NDAA-compliant uncooled longwave infrared (LWIR) camera module to deliver SXGA (1280 × 1024) resolution with an 8-micron (µm) pixel-pitch microbolometer. Engineered to minimize size, weight, and power (SWaP), Boson SX8 improves situational awareness in a compact, integration-ready form factor. Purpose-built for industrial, commercial, and defense integrations, Boson SX8 delivers 4× more pixels than a 640 × 512 VGA module, extending detection, recognition, and identification (DRI) range and providing clear imagery at long distances.

Multiple lens options, including a factory integrated continuous zoom lens, support a wide range of platforms, from uncrewed systems and counter-UAS to seekers, perimeter security, visual augmentation, and handheld devices. With high-speed performance and SXGA output, Boson SX8 helps operators see more, see farther, and do more. Boson SX8 helps accelerate development and reduce integration risk with an available graphical user interface (GUI), germanium-free lens configurations, and compatibility with Teledyne FLIR OEM’s Prism™ intelligent digital products. Manufactured at scale in the USA, it offers lower supply-chain risk, high reliability, and world-class support from a trusted volume supplier—setting a new standard for SWaP-optimized thermal imaging.

FLIR Boson SX8 - 18mm Lens

1280 × 1024 Resolution, 8-micron, SWaP-Optimized LWIR Camera Module

Boson® SX8 is the world’s first high-volume production, ITAR-free and NDAA-compliant uncooled longwave infrared (LWIR) camera module to deliver SXGA (1280 × 1024) resolution with an 8-micron (µm) pixel-pitch microbolometer. Engineered to minimize size, weight, and power (SWaP), Boson SX8 improves situational awareness in a compact, integration-ready form factor. Purpose-built for industrial, commercial, and defense integrations, Boson SX8 delivers 4× more pixels than a 640 × 512 VGA module, extending detection, recognition, and identification (DRI) range and providing clear imagery at long distances.

Multiple lens options, including a factory integrated continuous zoom lens, support a wide range of platforms, from uncrewed systems and counter-UAS to seekers, perimeter security, visual augmentation, and handheld devices. With high-speed performance and SXGA output, Boson SX8 helps operators see more, see farther, and do more. Boson SX8 helps accelerate development and reduce integration risk with an available graphical user interface (GUI), germanium-free lens configurations, and compatibility with Teledyne FLIR OEM’s Prism™ intelligent digital products. Manufactured at scale in the USA, it offers lower supply-chain risk, high reliability, and world-class support from a trusted volume supplier—setting a new standard for SWaP-optimized thermal imaging.

FLIR Boson SX8 - 24mm Lens

1280 × 1024 Resolution, 8-micron, SWaP-Optimized LWIR Camera Module

Boson® SX8 is the world’s first high-volume production, ITAR-free and NDAA-compliant uncooled longwave infrared (LWIR) camera module to deliver SXGA (1280 × 1024) resolution with an 8-micron (µm) pixel-pitch microbolometer. Engineered to minimize size, weight, and power (SWaP), Boson SX8 improves situational awareness in a compact, integration-ready form factor. Purpose-built for industrial, commercial, and defense integrations, Boson SX8 delivers 4× more pixels than a 640 × 512 VGA module, extending detection, recognition, and identification (DRI) range and providing clear imagery at long distances.

Multiple lens options, including a factory integrated continuous zoom lens, support a wide range of platforms, from uncrewed systems and counter-UAS to seekers, perimeter security, visual augmentation, and handheld devices. With high-speed performance and SXGA output, Boson SX8 helps operators see more, see farther, and do more. Boson SX8 helps accelerate development and reduce integration risk with an available graphical user interface (GUI), germanium-free lens configurations, and compatibility with Teledyne FLIR OEM’s Prism™ intelligent digital products. Manufactured at scale in the USA, it offers lower supply-chain risk, high reliability, and world-class support from a trusted volume supplier—setting a new standard for SWaP-optimized thermal imaging.

FLIR Boson SX8 - Lensless

1280 × 1024 Resolution, 8-micron, SWaP-Optimized LWIR Camera Module

Boson® SX8 is the world’s first high-volume production, ITAR-free and NDAA-compliant uncooled longwave infrared (LWIR) camera module to deliver SXGA (1280 × 1024) resolution with an 8-micron (µm) pixel-pitch microbolometer. Engineered to minimize size, weight, and power (SWaP), Boson SX8 improves situational awareness in a compact, integration-ready form factor. Purpose-built for industrial, commercial, and defense integrations, Boson SX8 delivers 4× more pixels than a 640 × 512 VGA module, extending detection, recognition, and identification (DRI) range and providing clear imagery at long distances.

Multiple lens options, including a factory integrated continuous zoom lens, support a wide range of platforms, from uncrewed systems and counter-UAS to seekers, perimeter security, visual augmentation, and handheld devices. With high-speed performance and SXGA output, Boson SX8 helps operators see more, see farther, and do more. Boson SX8 helps accelerate development and reduce integration risk with an available graphical user interface (GUI), germanium-free lens configurations, and compatibility with Teledyne FLIR OEM’s Prism™ intelligent digital products. Manufactured at scale in the USA, it offers lower supply-chain risk, high reliability, and world-class support from a trusted volume supplier—setting a new standard for SWaP-optimized thermal imaging.

FLIR Boson SX8 CZ 15-75 mm

1280 × 1024 Resolution, 8-micron, SWaP-Optimized LWIR Camera Module

Boson® SX8 is the world’s first high-volume production, ITAR-free and NDAA-compliant uncooled longwave infrared (LWIR) camera module to deliver SXGA (1280 × 1024) resolution with an 8-micron (µm) pixel-pitch microbolometer. Engineered to minimize size, weight, and power (SWaP), Boson SX8 improves situational awareness in a compact, integration-ready form factor. Purpose-built for industrial, commercial, and defense integrations, Boson SX8 delivers 4× more pixels than a 640 × 512 VGA module, extending detection, recognition, and identification (DRI) range and providing clear imagery at long distances.

Multiple lens options, including a factory integrated continuous zoom lens, support a wide range of platforms, from uncrewed systems and counter-UAS to seekers, perimeter security, visual augmentation, and handheld devices. With high-speed performance and SXGA output, Boson SX8 helps operators see more, see farther, and do more. Boson SX8 helps accelerate development and reduce integration risk with an available graphical user interface (GUI), germanium-free lens configurations, and compatibility with Teledyne FLIR OEM’s Prism™ intelligent digital products. Manufactured at scale in the USA, it offers lower supply-chain risk, high reliability, and world-class support from a trusted volume supplier—setting a new standard for SWaP-optimized thermal imaging.

Boson Tripod Mount

The Tripod-mount accessory, provides a means to mount a Boson assembly (or a Boson configured with either the VPC Accessory or the Camera Link Accessory) to a tripod via a standard 1/4-20 thread. It is designed to interface to the rear of the Boson via 4 x M1.6 screws.

Boson VPC Accessory

For the FLIR Boson Thermal Imaging Cameras

The Boson video/power/control (VPC) is an accessory that adapts the native high-density electrical connector to a simpler USB-C interface. The Kit includes a VPC adapter, and a USB-C to USB-A cable.

Boson VPC Accessory w/ Analog

For the FLIR Boson Thermal Imaging Cameras

The Boson video/power/control (VPC) is an accessory that adapts the native high-density electrical connector to a simpler USB-C interface.

The Kit includes a VPC adapter, as well as a bifurcated cable with USB-A (power/control) and BNC (video) connectors.

FLIR Boson+ - 13.8mm Lens

High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module

Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.

Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.

FLIR Boson+ - 18mm Lens

High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module

Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to ≤20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.

Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.