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633 products
633 products
Teledyne FLIR BOSON 640 x 512 4.9mm 95° HFoV - Short Lens - Shutterless LWIR Thermal Camera Core**
From $4,232.00
Unit price perTeledyne FLIR BOSON 640 x 512 4.9mm 95° HFoV - Short Lens - Shutterless LWIR Thermal Camera Core**
From $4,232.00
Unit price perFLIR Boson - 4.9mm Short Lens
Compact LWIR Thermal Camera
The Boson longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Teledyne FLIR BOSON 640 x 512 4.9mm 95° HFoV - Short Lens LWIR Thermal Camera Core
From $4,232.00
Unit price perTeledyne FLIR BOSON 640 x 512 4.9mm 95° HFoV - Short Lens LWIR Thermal Camera Core
From $4,232.00
Unit price perFLIR Boson - 4.9mm Short Lens
Compact LWIR Thermal Camera
The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
FLIR Boson - 55mm Lens
Compact LWIR Thermal Camera
The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Teledyne FLIR BOSON 640 x 512 55mm 8° HFoV - Radiometric LWIR Thermal Camera Core
From $5,200.00
Unit price perTeledyne FLIR BOSON 640 x 512 55mm 8° HFoV - Radiometric LWIR Thermal Camera Core
From $5,200.00
Unit price perFLIR Boson - 55mm Lens
Compact LWIR Radiometric Thermal Camera
The Boson longwave infrared (LWIR) radiometric thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
Your Application, Now With Radiometry.
Why Radiometry?
There are times when a simple thermal image is not enough to interpret a scene. In these scenarios, the ability to detect and record the temperature data from every pixel is vital to the task at hand. Radiometric thermal cameras measure the intensity of infrared signals reaching the camera to provide an accurate temperature reading of objects in the scene.
Built-In Spot Meter Accuracy
Boson Radiometric cameras include a Spot Meter Accuracy software feature that provides an assessment of how accurate a given temperature measurement appears in the scene. Available as telemetry data accessed through the Boson SDK or the Boson graphical user interface (GUI), this feature provides guidance across five confidence grades, offering in-the-moment assessment to help improve temperature measurement confidence.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and highest temperature rating -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Includes embedded algorithms for noise filters, gain control, blending, and more.
- Software-customizable functionality for video processing and power dissipation requirements.
- Built-in support for physical and protocol-level interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Customized applications through FLIR-trusted third party developers.
- Mechanical/electrical compatibility across all versions.
- Variety of hardware and image processing integration to fit OEM requirements.
Teledyne FLIR BOSON 640 x 512 55mm 8° HFoV - Shutterless LWIR Thermal Camera Core
From $6,372.00
Unit price perTeledyne FLIR BOSON 640 x 512 55mm 8° HFoV - Shutterless LWIR Thermal Camera Core
From $6,372.00
Unit price perFLIR Boson - 55mm Lens
Compact LWIR Thermal Camera
The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Teledyne FLIR BOSON 640 x 512 8.7mm 50° HFoV - LWIR Thermal Camera Core
From $4,104.00
Unit price perTeledyne FLIR BOSON 640 x 512 8.7mm 50° HFoV - LWIR Thermal Camera Core
From $4,104.00
Unit price perFLIR Boson - 8.7mm Lens
Compact LWIR Thermal Camera
The Boson longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Teledyne FLIR BOSON 640 x 512 8.7mm 50° HFoV - Shutterless LWIR Thermal Camera Core
From $4,231.00
Unit price perTeledyne FLIR BOSON 640 x 512 8.7mm 50° HFoV - Shutterless LWIR Thermal Camera Core
From $4,231.00
Unit price perFLIR Boson - 8.7mm Lens
Compact Shutterless LWIR Thermal Camera Core
The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Teledyne FLIR BOSON 640 x 512 9.2mm 50° HFoV - Short Lens - Radiometric LWIR Thermal Camera Core
From $4,592.00
Unit price perTeledyne FLIR BOSON 640 x 512 9.2mm 50° HFoV - Short Lens - Radiometric LWIR Thermal Camera Core
From $4,592.00
Unit price perFLIR Boson - 9.2mm Short Lens
Compact LWIR Radiometric Thermal Camera
The Boson longwave infrared (LWIR) radiometric thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
Your Application, Now With Radiometry.
Why Radiometry?
There are times when a simple thermal image is not enough to interpret a scene. In these scenarios, the ability to detect and record the temperature data from every pixel is vital to the task at hand. Radiometric thermal cameras measure the intensity of infrared signals reaching the camera to provide an accurate temperature reading of objects in the scene.
Built-In Spot Meter Accuracy
Boson Radiometric cameras include a Spot Meter Accuracy software feature that provides an assessment of how accurate a given temperature measurement appears in the scene. Available as telemetry data accessed through the Boson SDK or the Boson graphical user interface (GUI), this feature provides guidance across five confidence grades, offering in-the-moment assessment to help improve temperature measurement confidence.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and highest temperature rating -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Includes embedded algorithms for noise filters, gain control, blending, and more.
- Software-customizable functionality for video processing and power dissipation requirements.
- Built-in support for physical and protocol-level interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Customized applications through FLIR-trusted third party developers.
- Mechanical/electrical compatibility across all versions.
- Variety of hardware and image processing integration to fit OEM requirements.
Teledyne FLIR BOSON 640 x 512 9.2mm 50° HFoV - Short Lens - Shutterless LWIR Thermal Camera Core
From $4,489.00
Unit price perTeledyne FLIR BOSON 640 x 512 9.2mm 50° HFoV - Short Lens - Shutterless LWIR Thermal Camera Core
From $4,489.00
Unit price perFLIR Boson - 9.2mm Short Lens
Compact Shutterless LWIR Thermal Camera
The Boson longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Teledyne FLIR BOSON 640 x 512 9.2mm 50° HFoV - Short Lens LWIR Thermal Camera Core
From $4,489.00
Unit price perTeledyne FLIR BOSON 640 x 512 9.2mm 50° HFoV - Short Lens LWIR Thermal Camera Core
From $4,489.00
Unit price perFLIR Boson 9.2mm Lens
Compact LWIR Thermal Camera
The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
FLIR Boson - Lensless Core
Compact LWIR Thermal Camera
The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Teledyne FLIR BOSON 640 x 512 Lensless - Shutterless LWIR Thermal Camera Core
From $3,558.00
Unit price perTeledyne FLIR BOSON 640 x 512 Lensless - Shutterless LWIR Thermal Camera Core
From $3,558.00
Unit price perFLIR Boson - Lensless Core
Compact Shutterless LWIR Thermal Camera
The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Camera Link Accessory Kit
For the FLIR Boson Thermal Imaging Cameras
Expansion board for Boson cameras that matches the functionality of the VPC module, and enables the camera to be interfaced to a Camera Link frame grabber, allowing the capture of digital 16-bit video data.
(This product does not include Camera Link cable, frame grab board, or data capture software.)
Boson Test Board, Detail PCB ASSEMBLY
Boson Development Board
The Development breakout board for Boson users and integrators that need easy access to the Boson I/O and interfaces. This board is intended for user development purposes, and is not intended or rated for long term reliability over temperature.
It provides full access to the Boson 80-pin connector with a number of connectors:
- standard USB-3 micro-B (Super Speed) receptacle
- standard SDR-26 receptacle with Camera-Link compliant output
- SDIO card slot
- UART header
- I2C header
- SPI header
- Power jacks