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81 products
81 products
Teledyne FLIR BOSON+ 320 x 256 4.3mm 50° HFoV - LWIR Thermal Camera Core
From $2,525.00
Unit price perTeledyne FLIR BOSON+ 320 x 256 4.3mm 50° HFoV - LWIR Thermal Camera Core
From $2,525.00
Unit price perFLIR Boson+ 320 - 4.3mm Lens
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY
Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.
- ≤20 mK thermal sensitivity
- Improved latency for faster decision support
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Low power consumption, starting at 900 mW
- Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
- Rugged construction and operating temperature rating of -40 °C to 80 °C
DESIGNED FOR INTEGRATORS
Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.
- Comprehensive product integration documentation and easy-to-use Boson GUI.
- Highly qualified Technical Services team available to support integration
- Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
- Flexible USB and CMOS or USB and MIPI interface
Teledyne FLIR BOSON+ 320 x 256 55mm 4.0° HFoV - LWIR Thermal Camera Core
From $3,366.00
Unit price perTeledyne FLIR BOSON+ 320 x 256 55mm 4.0° HFoV - LWIR Thermal Camera Core
From $3,366.00
Unit price perFLIR Boson+ - 55mm Lens
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY
Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.
- ≤20 mK thermal sensitivity
- Improved latency for faster decision support
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Low power consumption, starting at 900 mW
- Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
- Rugged construction and operating temperature rating of -40 °C to 80 °C
DESIGNED FOR INTEGRATORS
Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.
- Comprehensive product integration documentation and easy-to-use Boson GUI.
- Highly qualified Technical Services team available to support integration
- Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
- Flexible USB and CMOS or USB and MIPI interface
Teledyne FLIR BOSON+ 320 x 256 4.5mm 50° HFoV - Short Lens LWIR Thermal Camera Core
From $2,525.00
Unit price perTeledyne FLIR BOSON+ 320 x 256 4.5mm 50° HFoV - Short Lens LWIR Thermal Camera Core
From $2,525.00
Unit price perFLIR Boson+ 320 - 4.5mm Short Lens
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY
Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.
- ≤20 mK thermal sensitivity
- Improved latency for faster decision support
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Low power consumption, starting at 900 mW
- Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
- Rugged construction and operating temperature rating of -40 °C to 80 °C
DESIGNED FOR INTEGRATORS
Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.
- Comprehensive product integration documentation and easy-to-use Boson GUI.
- Highly qualified Technical Services team available to support integration
- Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
- Flexible USB and CMOS or USB and MIPI interface
Teledyne FLIR BOSON+ 320 x 256 6.3mm 34° HFoV - LWIR Thermal Camera Core
From $2,525.00
Unit price perTeledyne FLIR BOSON+ 320 x 256 6.3mm 34° HFoV - LWIR Thermal Camera Core
From $2,525.00
Unit price perFLIR Boson+ - 6.3mm Lens
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY
Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.
- ≤20 mK thermal sensitivity
- Improved latency for faster decision support
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Low power consumption, starting at 900 mW
- Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
- Rugged construction and operating temperature rating of -40 °C to 80 °C
DESIGNED FOR INTEGRATORS
Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.
- Comprehensive product integration documentation and easy-to-use Boson GUI.
- Highly qualified Technical Services team available to support integration
- Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
- Flexible USB and CMOS or USB and MIPI interface
Teledyne FLIR BOSON+ 320 x 256 9.1mm 24° HFoV - LWIR Thermal Camera Core
From $2,525.00
Unit price perTeledyne FLIR BOSON+ 320 x 256 9.1mm 24° HFoV - LWIR Thermal Camera Core
From $2,525.00
Unit price perFLIR Boson+ - 9.1mm Lens
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY
Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.
- ≤20 mK thermal sensitivity
- Improved latency for faster decision support
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Low power consumption, starting at 900 mW
- Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
- Rugged construction and operating temperature rating of -40 °C to 80 °C
DESIGNED FOR INTEGRATORS
Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.
- Comprehensive product integration documentation and easy-to-use Boson GUI.
- Highly qualified Technical Services team available to support integration
- Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
- Flexible USB and CMOS or USB and MIPI interface
Boson®+ CZ 14-75
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in the USA, the Boson+ CZ 14-75 combines Teledyne FLIR’s Boson+ world-class longwave infrared (LWIR) OEM camera module and 5x continuous zoom (CZ) lens offering a high–performance imaging solution. It features an industry-leading thermal sensitivity of ≤20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness. The high-performance lens and control electronics maintain focus through zoom and provide real-time thermal gradient compensation as well as flexibility for user-defined command syntax and expansion for additional features.
The Boson+ camera module and 14 mm to 75 mm CZ lens are designed for each other, providing optimal performance and a single system warranty only achievable from a single source. The factory-integrated system lowers development and manufacturing risk and improves time-to-market, making the reliable Boson+ CZ 14-75 ideal for unmanned aerial vehicles, perimeter surveillance, light armored vehicle situational awareness and targeting, and soldier sighting systems.
MARKET-LEADING THERMAL SENSITIVITY, CONTRAST, AND LATENCY
NEDT of ≤20 mK extends detection, recognition, and identification (DRI) performance
- 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
- ≤20 mK thermal sensitivity
- Rugged construction with an operating temperature rating of -40 °C to 80 °C
- Upgraded AGC provides blacker blacks and whiter whites
SEAMLESS OPTOMECHANICAL INTEGRATION
Camera and lens factory-designed to optimize performance and cost
- Factory alignment eliminates boresight wander through zoom
- Calibrated for maximum performance and MTF
- Object focus range compensation for near targets
- Thermal gradient compensation provides focus through full temperature range
DESIGNED FOR INTEGRATORS
Advanced control electronics, hardware, and integration support simplify integration and maximize reliability
- USB, CMOS, and MIPI video output interfaces
- Flexible user-defined command aliases
- Built-in Test (BIT) provides real-time feedback
- Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
Teledyne FLIR BOSON+ 640 x 512 18mm 24° HFoV - Shutterless LWIR Thermal Camera Core
From $5,289.00
Unit price perTeledyne FLIR BOSON+ 640 x 512 18mm 24° HFoV - Shutterless LWIR Thermal Camera Core
From $5,289.00
Unit price perFLIR Boson+ 18mm Lens Shutterless
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Teledyne FLIR BOSON 640 x 512 9.2mm 50° HFoV - Short Lens - Shutterless LWIR Thermal Camera Core
From $4,489.00
Unit price perTeledyne FLIR BOSON 640 x 512 9.2mm 50° HFoV - Short Lens - Shutterless LWIR Thermal Camera Core
From $4,489.00
Unit price perFLIR Boson - 9.2mm Short Lens
Compact Shutterless LWIR Thermal Camera
The Boson longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Teledyne FLIR BOSON 640 x 512 13.6mm 32° HFoV - Short Lens - Shutterless LWIR Thermal Camera Core
From $4,489.00
Unit price perTeledyne FLIR BOSON 640 x 512 13.6mm 32° HFoV - Short Lens - Shutterless LWIR Thermal Camera Core
From $4,489.00
Unit price perFLIR Boson - 13.6mm Lens
Compact Shutterless LWIR Thermal Camera
The Boson longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Teledyne FLIR BOSON+ 640 x 512 24mm 18° HFoV - Shutterless LWIR Thermal Camera Core
From $5,289.00
Unit price perTeledyne FLIR BOSON+ 640 x 512 24mm 18° HFoV - Shutterless LWIR Thermal Camera Core
From $5,289.00
Unit price perFLIR Boson+ 24mm Lens - Shutterless
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Teledyne FLIR BOSON 640 x 512 18mm 24° HFoV - Short Lens - Shutterless LWIR Thermal Camera Core
From $4,489.00
Unit price perTeledyne FLIR BOSON 640 x 512 18mm 24° HFoV - Short Lens - Shutterless LWIR Thermal Camera Core
From $4,489.00
Unit price perFLIR Boson - 18mm Lens
Compact Short Lens Shutterless LWIR Thermal Camera
The Boson longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5 g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Teledyne FLIR BOSON+ 640 x 512 13.6mm 32° HFoV - Short Lens - Shutterless LWIR Thermal Camera Core
From $5,577.00
Unit price perTeledyne FLIR BOSON+ 640 x 512 13.6mm 32° HFoV - Short Lens - Shutterless LWIR Thermal Camera Core
From $5,577.00
Unit price perFLIR Boson+ 13.6mm Short Lens Shutterless
Compact LWIR Thermal Camera
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Teledyne FLIR BOSON+ 640 x 512 18mm 24° HFoV - Short Lens - Shutterless LWIR Thermal Camera Core
From $5,526.00
Unit price perTeledyne FLIR BOSON+ 640 x 512 18mm 24° HFoV - Short Lens - Shutterless LWIR Thermal Camera Core
From $5,526.00
Unit price perFLIR Boson+ 18mm Shutterless Short Lens
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Teledyne FLIR BOSON+ 640 x 512 9.2mm 50° HFoV - Short Lens - Shutterless LWIR Thermal Camera Core
From $5,542.00
Unit price perTeledyne FLIR BOSON+ 640 x 512 9.2mm 50° HFoV - Short Lens - Shutterless LWIR Thermal Camera Core
From $5,542.00
Unit price perFLIR Boson+ - 9.2mm Short Lens
Compact LWIR Thermal Camera
The Boson longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Teledyne FLIR BOSON+ 640 x 512 4.9mm 95° HFoV - Short Lens - Shutterless LWIR Thermal Camera Core
From $5,289.00
Unit price perTeledyne FLIR BOSON+ 640 x 512 4.9mm 95° HFoV - Short Lens - Shutterless LWIR Thermal Camera Core
From $5,289.00
Unit price perFLIR Boson+ - 4.9mm Short Lens
Compact LWIR Thermal Camera
The Boson longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.