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81 products
Teledyne FLIR BOSON 640 x 512 8.7mm 50° HFoV - Shutterless LWIR Thermal Camera Core
From $4,231.00
Unit price perTeledyne FLIR BOSON 640 x 512 8.7mm 50° HFoV - Shutterless LWIR Thermal Camera Core
From $4,231.00
Unit price perFLIR Boson - 8.7mm Lens
Compact Shutterless LWIR Thermal Camera Core
The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Teledyne FLIR BOSON 640 x 512 Lensless - Shutterless LWIR Thermal Camera Core
From $3,558.00
Unit price perTeledyne FLIR BOSON 640 x 512 Lensless - Shutterless LWIR Thermal Camera Core
From $3,558.00
Unit price perFLIR Boson - Lensless Core
Compact Shutterless LWIR Thermal Camera
The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Teledyne FLIR BOSON+ 640 x 512 14mm 32° HFoV - LWIR Thermal Camera Core
From $5,289.00
Unit price perTeledyne FLIR BOSON+ 640 x 512 14mm 32° HFoV - LWIR Thermal Camera Core
From $5,289.00
Unit price perFLIR Boson+ 14mm Lens
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY
Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.
- ≤20 mK thermal sensitivity
- Improved latency for faster decision support
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Low power consumption, starting at 900 mW
- Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
- Rugged construction and operating temperature rating of -40 °C to 80 °C
DESIGNED FOR INTEGRATORS
Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.
- Comprehensive product integration documentation and easy-to-use Boson GUI.
- Highly qualified Technical Services team available to support integration
- Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
- Flexible USB and CMOS or USB and MIPI interface
Teledyne FLIR BOSON+ 640 x 512 18mm 24° HFoV - LWIR Thermal Camera Core
From $5,289.00
Unit price perTeledyne FLIR BOSON+ 640 x 512 18mm 24° HFoV - LWIR Thermal Camera Core
From $5,289.00
Unit price perFLIR Boson+ 18mm Lens
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY
Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.
- ≤20 mK thermal sensitivity
- Improved latency for faster decision support
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Low power consumption, starting at 900 mW
- Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
- Rugged construction and operating temperature rating of -40 °C to 80 °C
DESIGNED FOR INTEGRATORS
Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.
- Comprehensive product integration documentation and easy-to-use Boson GUI.
- Highly qualified Technical Services team available to support integration
- Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
- Flexible USB and CMOS or USB and MIPI interface
Teledyne FLIR BOSON+ 640 x 512 24mm 18° HFoV - LWIR Thermal Camera Core
From $5,289.00
Unit price perTeledyne FLIR BOSON+ 640 x 512 24mm 18° HFoV - LWIR Thermal Camera Core
From $5,289.00
Unit price perFLIR Boson+ 24mm Lens
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY
Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.
- ≤20 mK thermal sensitivity
- Improved latency for faster decision support
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Low power consumption, starting at 900 mW
- Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
- Rugged construction and operating temperature rating of -40 °C to 80 °C
DESIGNED FOR INTEGRATORS
Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.
- Comprehensive product integration documentation and easy-to-use Boson GUI.
- Highly qualified Technical Services team available to support integration
- Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
- Flexible USB and CMOS or USB and MIPI interface
Teledyne FLIR BOSON+ 640 x 512 55mm 8° HFoV - LWIR Thermal Camera Core
From $6,372.00
Unit price perTeledyne FLIR BOSON+ 640 x 512 55mm 8° HFoV - LWIR Thermal Camera Core
From $6,372.00
Unit price perFLIR Boson+ 55mm Lens
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY
Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.
- ≤20 mK thermal sensitivity
- Improved latency for faster decision support
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Low power consumption, starting at 900 mW
- Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
- Rugged construction and operating temperature rating of -40 °C to 80 °C
DESIGNED FOR INTEGRATORS
Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.
- Comprehensive product integration documentation and easy-to-use Boson GUI.
- Highly qualified Technical Services team available to support integration
- Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
- Flexible USB and CMOS or USB and MIPI interface
Teledyne FLIR BOSON+ 640 x 512 36mm 12° HFoV - LWIR Thermal Camera Core
From $6,372.00
Unit price perTeledyne FLIR BOSON+ 640 x 512 36mm 12° HFoV - LWIR Thermal Camera Core
From $6,372.00
Unit price perFLIR Boson+ 36mm Lens
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
The Boson longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Teledyne FLIR Neutrino LC - CZ 15-300 HOT MWIR Camera Module + Continuous Zoom Lens
$0.00
Unit price perTeledyne FLIR Neutrino LC - CZ 15-300 HOT MWIR Camera Module + Continuous Zoom Lens
$0.00
Unit price perNeutrino LC - CZ 15-300
HOT MWIR Camera Module + Continuous Zoom Lens
Neutrino IS series combines Teledyne FLIR’s world-class mid-wavelength infrared (MWIR) OEM camera modules and continuous zoom (CZ) lenses to offer high–performance imaging solutions with various FPA resolutions and CZ zoom/FOV ranges. Neutrino IS lowers development and manufacturing risk and improves time-to-market. Cutting-edge HOT FPAs, long life and low vibration linear coolers, common camera interfaces, and fully athermalized lenses make for the best-in-class solution. Each camera module and lens are designed for each other, providing optimal performance not achievable when buying and integrating cameras and lenses from multiple sources.
Teledyne FLIR Neutrino IS series is simply the best technical solution available. With nearly off-the-shelf delivery, industry-leading two-year warranty, real price competitiveness and well-known product support and product reliability, it offers the lowest risk solution. The Neutrino IS is an OEM camera module that is intended to be integrated into a higher level system.
SWAP+C OPTIMIZED SENSOR ENGINE
SWaP+C optimized design saves space, weight, and power, resulting in operational and cost benefits and the ability to integrate into smaller spaces.
- HOT MWIR Sensor Technology
- Tight optics-to-camera tolerances minimize optics size and mass
- Best-in-class power consumption
RELIABLE LINEAR COOLER
Designed from the ground up for optimum performance and reliability minimize cost of ownership and maximize operational uptime
- Increased reliability and low vibration
- 2x faster time to image
- Reduce user fatigue and operate for longer periods
- Comprehensive product documentation
MARKET LEADING THERMAL OPTICS
Integrated SWaP optimized lens provides instant clear imaging able to withstand every rugged environment.
- Smooth continuous zoom
- Precision aligned camera and lens with a collimator and sophisticated test equipment
- Highly qualified Teledyne FLIR Technical Services team available to support integration
Teledyne FLIR BOSON 640 x 512 4.9mm 95° HFoV - Short Lens - Shutterless LWIR Thermal Camera Core**
From $4,232.00
Unit price perTeledyne FLIR BOSON 640 x 512 4.9mm 95° HFoV - Short Lens - Shutterless LWIR Thermal Camera Core**
From $4,232.00
Unit price perFLIR Boson - 4.9mm Short Lens
Compact LWIR Thermal Camera
The Boson longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Teledyne FLIR BOSON+ 640 x 512 9.2mm 50° HFoV - Short Lens LWIR Thermal Camera Core
From $5,542.00
Unit price perTeledyne FLIR BOSON+ 640 x 512 9.2mm 50° HFoV - Short Lens LWIR Thermal Camera Core
From $5,542.00
Unit price perTeledyne FLIR BOSON+ - 9.2mm Short Lens
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY
Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.
- ≤20 mK thermal sensitivity
- Improved latency for faster decision support
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Low power consumption, starting at 900 mW
- Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
- Rugged construction and operating temperature rating of -40 °C to 80 °C
DESIGNED FOR INTEGRATORS
Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.
- Comprehensive product integration documentation and easy-to-use Boson GUI.
- Highly qualified Technical Services team available to support integration
- Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
- Flexible USB and CMOS or USB and MIPI interface
Teledyne FLIR BOSON+ 640 x 512 13.6mm 32° HFoV - Short Lens LWIR Thermal Camera Core
From $5,577.00
Unit price perTeledyne FLIR BOSON+ 640 x 512 13.6mm 32° HFoV - Short Lens LWIR Thermal Camera Core
From $5,577.00
Unit price perTeledyne FLIR Boson - 13.6mm Short Lens
Compact LWIR Thermal Camera
The Boson longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Teledyne FLIR BOSON+ 320 x 256 13.8mm 16° HFoV - LWIR Thermal Camera Core**
From $2,525.00
Unit price perTeledyne FLIR BOSON+ 320 x 256 13.8mm 16° HFoV - LWIR Thermal Camera Core**
From $2,525.00
Unit price perFLIR Boson+ - 13.8mm Lens
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY
Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.
- ≤20 mK thermal sensitivity
- Improved latency for faster decision support
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Low power consumption, starting at 900 mW
- Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
- Rugged construction and operating temperature rating of -40 °C to 80 °C
DESIGNED FOR INTEGRATORS
Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.
- Comprehensive product integration documentation and easy-to-use Boson GUI.
- Highly qualified Technical Services team available to support integration
- Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
- Flexible USB and CMOS or USB and MIPI interface
Teledyne FLIR BOSON+ 320 x 256 18mm 12° HFoV - LWIR Thermal Camera Core
From $3,366.00
Unit price perTeledyne FLIR BOSON+ 320 x 256 18mm 12° HFoV - LWIR Thermal Camera Core
From $3,366.00
Unit price perFLIR Boson+ - 18mm Lens
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to ≤20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY
Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.
- ≤20 mK thermal sensitivity
- Improved latency for faster decision support
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Low power consumption, starting at 900 mW
- Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
- Rugged construction and operating temperature rating of -40 °C to 80 °C
DESIGNED FOR INTEGRATORS
Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.
- Comprehensive product integration documentation and easy-to-use Boson GUI.
- Highly qualified Technical Services team available to support integration
- Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
- Flexible USB and CMOS or USB and MIPI interface
Teledyne FLIR BOSON+ 320 x 256 2.3mm 92° HFoV - LWIR Thermal Camera Core
From $2,525.00
Unit price perTeledyne FLIR BOSON+ 320 x 256 2.3mm 92° HFoV - LWIR Thermal Camera Core
From $2,525.00
Unit price perFLIR Boson+ - 2.3mm Lens
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY
Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.
- ≤20 mK thermal sensitivity
- Improved latency for faster decision support
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Low power consumption, starting at 900 mW
- Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
- Rugged construction and operating temperature rating of -40 °C to 80 °C
DESIGNED FOR INTEGRATORS
Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.
- Comprehensive product integration documentation and easy-to-use Boson GUI.
- Highly qualified Technical Services team available to support integration
- Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
- Flexible USB and CMOS or USB and MIPI interface
Teledyne FLIR BOSON+ 320 x 256 36mm 6.1° HFoV - LWIR Thermal Camera Core
From $3,366.00
Unit price perTeledyne FLIR BOSON+ 320 x 256 36mm 6.1° HFoV - LWIR Thermal Camera Core
From $3,366.00
Unit price perFLIR Boson+ - 36mm Lens
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY
Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.
- ≤20 mK thermal sensitivity
- Improved latency for faster decision support
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Low power consumption, starting at 900 mW
- Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
- Rugged construction and operating temperature rating of -40 °C to 80 °C
DESIGNED FOR INTEGRATORS
Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.
- Comprehensive product integration documentation and easy-to-use Boson GUI.
- Highly qualified Technical Services team available to support integration
- Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
- Flexible USB and CMOS or USB and MIPI interface