Sort by:
81 products
81 products
Teledyne FLIR BOSON+ 640 x 512 32mm 13.5° HFoV - LWIR Thermal Camera Core
From $6,372.00
Unit price perTeledyne FLIR BOSON+ 640 x 512 32mm 13.5° HFoV - LWIR Thermal Camera Core
From $6,372.00
Unit price perFLIR Boson+ 32mm Lens
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY
Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.
- ≤20 mK thermal sensitivity
- Improved latency for faster decision support
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Low power consumption, starting at 900 mW
- Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
- Rugged construction and operating temperature rating of -40 °C to 80 °C
DESIGNED FOR INTEGRATORS
Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.
- Comprehensive product integration documentation and easy-to-use Boson GUI.
- Highly qualified Technical Services team available to support integration
- Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
- Flexible USB and CMOS or USB and MIPI interface
Teledyne FLIR BOSON+ 640 x 512 32mm 13.5° HFoV – Shutterless LWIR Thermal Camera Core
From $6,372.00
Unit price perTeledyne FLIR BOSON+ 640 x 512 32mm 13.5° HFoV – Shutterless LWIR Thermal Camera Core
From $6,372.00
Unit price perFLIR Boson+ 32mm Lens - Shutterless
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY
Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.
- ≤20 mK thermal sensitivity
- Improved latency for faster decision support
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Low power consumption, starting at 900 mW
- Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
- Rugged construction and operating temperature rating of -40 °C to 80 °C
DESIGNED FOR INTEGRATORS
Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.
- Comprehensive product integration documentation and easy-to-use Boson GUI.
- Highly qualified Technical Services team available to support integration
- Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
- Flexible USB and CMOS or USB and MIPI interface
Teledyne FLIR BOSON 320 x 256 4.3mm 50° HFoV - LWIR Thermal Camera Core
From $2,020.00
Unit price perTeledyne FLIR BOSON 320 x 256 4.3mm 50° HFoV - LWIR Thermal Camera Core
From $2,020.00
Unit price perFLIR Boson 320 - 4.3mm Lens
Compact LWIR Thermal Camera
The Boson longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
FLIR Boson SX8 - 24mm Lens
1280 × 1024 Resolution, 8-micron, SWaP-Optimized LWIR Camera Module
Boson® SX8 is the world’s first high-volume production, ITAR-free and NDAA-compliant uncooled longwave infrared (LWIR) camera module to deliver SXGA (1280 × 1024) resolution with an 8-micron (µm) pixel-pitch microbolometer. Engineered to minimize size, weight, and power (SWaP), Boson SX8 improves situational awareness in a compact, integration-ready form factor. Purpose-built for industrial, commercial, and defense integrations, Boson SX8 delivers 4× more pixels than a 640 × 512 VGA module, extending detection, recognition, and identification (DRI) range and providing clear imagery at long distances.
Multiple lens options, including a factory integrated continuous zoom lens, support a wide range of platforms, from uncrewed systems and counter-UAS to seekers, perimeter security, visual augmentation, and handheld devices. With high-speed performance and SXGA output, Boson SX8 helps operators see more, see farther, and do more. Boson SX8 helps accelerate development and reduce integration risk with an available graphical user interface (GUI), germanium-free lens configurations, and compatibility with Teledyne FLIR OEM’s Prism™ intelligent digital products. Manufactured at scale in the USA, it offers lower supply-chain risk, high reliability, and world-class support from a trusted volume supplier—setting a new standard for SWaP-optimized thermal imaging.
High-performance 1280 × 1024 clarity in a SWaP-optimized package
- New SWaP-optimized 8 µm pixel pitch
- Market-leading 1280 × 1024 (SXGA) resolution
- 30 Hz and 60 Hz with roadmap to higher frame-rate options
Integration-ready design that is AI-ready
- Boson SX8 GUI available
- Multiple lens options, including Ge-free models
- Compatible with intelligent Prism digital products
- Compact, factory-integrated CZ lens option
A trusted development partner and low-risk volume supplier
- World-class support and service
- ITAR-free and NDAA-compliant
- High-volume manufacturing in the USA
- Classified under U.S. Department of Commerce jurisdiction as EAR 6A003.b.4.b
FLIR Boson SX8 - 18mm Lens
1280 × 1024 Resolution, 8-micron, SWaP-Optimized LWIR Camera Module
Boson® SX8 is the world’s first high-volume production, ITAR-free and NDAA-compliant uncooled longwave infrared (LWIR) camera module to deliver SXGA (1280 × 1024) resolution with an 8-micron (µm) pixel-pitch microbolometer. Engineered to minimize size, weight, and power (SWaP), Boson SX8 improves situational awareness in a compact, integration-ready form factor. Purpose-built for industrial, commercial, and defense integrations, Boson SX8 delivers 4× more pixels than a 640 × 512 VGA module, extending detection, recognition, and identification (DRI) range and providing clear imagery at long distances.
Multiple lens options, including a factory integrated continuous zoom lens, support a wide range of platforms, from uncrewed systems and counter-UAS to seekers, perimeter security, visual augmentation, and handheld devices. With high-speed performance and SXGA output, Boson SX8 helps operators see more, see farther, and do more. Boson SX8 helps accelerate development and reduce integration risk with an available graphical user interface (GUI), germanium-free lens configurations, and compatibility with Teledyne FLIR OEM’s Prism™ intelligent digital products. Manufactured at scale in the USA, it offers lower supply-chain risk, high reliability, and world-class support from a trusted volume supplier—setting a new standard for SWaP-optimized thermal imaging.
High-performance 1280 × 1024 clarity in a SWaP-optimized package
- New SWaP-optimized 8 µm pixel pitch
- Market-leading 1280 × 1024 (SXGA) resolution
- 30 Hz and 60 Hz with roadmap to higher frame-rate options
Integration-ready design that is AI-ready
- Boson SX8 GUI available
- Multiple lens options, including Ge-free models
- Compatible with intelligent Prism digital products
- Compact, factory-integrated CZ lens option
A trusted development partner and low-risk volume supplier
- World-class support and service
- ITAR-free and NDAA-compliant
- High-volume manufacturing in the USA
- Classified under U.S. Department of Commerce jurisdiction as EAR 6A003.b.4.b
FLIR Boson SX8 - 12mm Lens
1280 × 1024 Resolution, 8-micron, SWaP-Optimized LWIR Camera Module
Boson® SX8 is the world’s first high-volume production, ITAR-free and NDAA-compliant uncooled longwave infrared (LWIR) camera module to deliver SXGA (1280 × 1024) resolution with an 8-micron (µm) pixel-pitch microbolometer. Engineered to minimize size, weight, and power (SWaP), Boson SX8 improves situational awareness in a compact, integration-ready form factor. Purpose-built for industrial, commercial, and defense integrations, Boson SX8 delivers 4× more pixels than a 640 × 512 VGA module, extending detection, recognition, and identification (DRI) range and providing clear imagery at long distances.
Multiple lens options, including a factory integrated continuous zoom lens, support a wide range of platforms, from uncrewed systems and counter-UAS to seekers, perimeter security, visual augmentation, and handheld devices. With high-speed performance and SXGA output, Boson SX8 helps operators see more, see farther, and do more. Boson SX8 helps accelerate development and reduce integration risk with an available graphical user interface (GUI), germanium-free lens configurations, and compatibility with Teledyne FLIR OEM’s Prism™ intelligent digital products. Manufactured at scale in the USA, it offers lower supply-chain risk, high reliability, and world-class support from a trusted volume supplier—setting a new standard for SWaP-optimized thermal imaging.
High-performance 1280 × 1024 clarity in a SWaP-optimized package
- New SWaP-optimized 8 µm pixel pitch
- Market-leading 1280 × 1024 (SXGA) resolution
- 30 Hz and 60 Hz with roadmap to higher frame-rate options
Integration-ready design that is AI-ready
- Boson SX8 GUI available
- Multiple lens options, including Ge-free models
- Compatible with intelligent Prism digital products
- Compact, factory-integrated CZ lens option
A trusted development partner and low-risk volume supplier
- World-class support and service
- ITAR-free and NDAA-compliant
- High-volume manufacturing in the USA
- Classified under U.S. Department of Commerce jurisdiction as EAR 6A003.b.4.b