Teledyne FLIR BOSON+ 640 x 512 9.2mm 50° HFoV - Short Lens - Shutterless LWIR Thermal Camera Core

$5,542.00

• Resolution: 640x512 - 50° HFoV
• Shutterless
• Short Lens
• 640x480 resolution
• 50° HFoV
• 12 µm pixel pitch VOx microbolometer
• Multiple high-performance FOV options
• Dimensions with Lens: 41.16 x 29 x 34.5 mm
• Weight with lens: 34.7 grams
• Low power consumption, starting at 500 mW
• Rugged construction and highest temperature rating -40 °C to +80 °C

Professional Grade <30mK NEDT  SKU:23640AS50-6PAAX - $5542.00
Industrial Grade <20mK NEDT  SKU:23640AS50-6IAAX - $6598.00

Interfaces and Accessories sold separately.

We usually have a majority of these items in stock. Please call or contact us for availability.

SKU: 23640AS50-6PAAX
boson-640S-9mm 50HFoV-angle-view

Teledyne FLIR BOSON+ 640 x 512 9.2mm 50° HFoV - Short Lens - Shutterless LWIR Thermal Camera Core

$5,542.00

$5,542.00

Description
Specifications
Downloads

FLIR Boson+ - 9.2mm Short Lens

Compact LWIR Thermal Camera

The Boson longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.

With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.

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DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE

A full-featured VGA thermal camera module at less than 4.9cm3.

  • 21 x 21 x 11 mm camera body and weight as low as 7.5g.
  • Low power consumption, starting at 500 mW
  • 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
  • Rugged construction and -40 °C to 80 °C.
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POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE

FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.

  • Embedded noise filters, gain control, blending, and more.
  • Software-customizable processing and power options.
  • Built-in support for interface standards.
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WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET

Unprecedented integration flexibility for fast, affordable developments.

  • Custom applications via third-party developers.
  • Mechanical/electrical compatibility across versions.
  • OEM integration flexibility.

Resolution

640 x 512

Pixel Pitch

12 µm

Spectral Band

LWIR | 8 µm – 14 µm

Noise Level (NEdT Value)

Boson+ Professional Grade <30 mK NEdT, Boson+ Industrial Grade <20 mK NEdT

Frame Rate Option

60Hz default; 30 Hz runtime selectable

Shutter

No

Solar protection

Yes, lens only

Continuous Digital Zoom

1X to 8X zoom

Symbology

Re-writable each frame; alpha blending for translucent overlay

Radiometry

No

Scene Dynamic Range

to 140 °C (high gain)

Temperature Accuracy

—

Field of View

50° HFoV

Focal Length

9.2mm

Short Lens

Yes

f-number

f/1.0

Dimensions (L x W x H)

21 × 21 × 11 mm without lens

Weight

7.5 g without lens (configuration dependent)

Precision Mounting Holes

Four tapped M1.6 x 0.35 (rear cover). Lens support recommended when lens mass exceeds core mass.

Input Voltage

3.3 VDC

Power Dissipation

Varies by configuration. 320+ as low as 500 mW, 640+ as low as 1000 mW

Video Channels

CMOS, MIPI or USB3

Control Channels

UART, USB or I2C

Configurable GPIO

Up to 11; user configurable

Operating Temperature Range

-40°C to 80°C

Non-Op. Temp. Range

-50 °C to 85 °C (-58 °F to 185 °F)

Shock

1, 500 g @ 0.4 msec

Operational Altitude

12 km (max altitude of a commercial airliner or airborne platform)

Boson Enclosure Compatible

Yes

IDD CAD Data Boson 640SL - 9.2mm-f1.0

This IDD CAD Data package includes a comprehensive set of design resources, featuring a .STEP file and an accompanying PDF. The .STEP file provides a detailed 3D model that ensures compatibility with various CAD software, facilitating seamless integration into your projects. The PDF offers essential documentation, including specifications, dimensions, and guidelines to help you make the most of the provided CAD data. Download the zip file to access these valuable resources for your design and engineering needs.

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Teledyne FLIR Boson Plus Datasheet

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Boson Family Brochure

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