Teledyne FLIR BOSON+ 640 x 512 18mm 24° HFoV - Short Lens - Shutterless LWIR Thermal Camera Core

$5,526.00

• Resolution: 640x512 - 24° HFoV
• Shutterless
• Short Lens
12 µm pixel pitch VOx microbolometer
• 21 x 21 x 11 mm, (4.9 cm3 ) camera body
• Weight as low as 7.5 grams
• Low power consumption, starting at 500 mW
• Rugged construction and highest temperature rating -40°C to +80°C

Professional Grade<30mK NEDT - SKU: 23640AS24-6PAAX $5526.00 
Industrial Grade <20mK NEDT - SKU: 23640AS24-6IAAX $6588.00  

Interfaces and Accessories sold separately.

We usually have a majority of these items in stock. Please call or contact us for availability.

SKU: 23640AS24-6PAAX
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Teledyne FLIR BOSON+ 640 x 512 18mm 24° HFoV - Short Lens - Shutterless LWIR Thermal Camera Core

$5,526.00

$5,526.00

Description
Specifications
Downloads

FLIR Boson+ 18mm Shutterless Short Lens

High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module

Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.

 

Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.

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DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE

A full-featured VGA thermal camera module at less than 4.9cm3.

  • 21 x 21 x 11 mm camera body and weight as low as 7.5g.
  • Low power consumption, starting at 500 mW
  • 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
  • Rugged construction and -40 °C to 80 °C.
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POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE

FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.

  • Embedded noise filters, gain control, blending, and more.
  • Software-customizable processing and power options.
  • Built-in support for interface standards.
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WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET

Unprecedented integration flexibility for fast, affordable developments.

  • Custom applications via third-party developers.
  • Mechanical/electrical compatibility across versions.
  • OEM integration flexibility.

Resolution

640 x 512

Pixel Pitch

12 µm

Spectral Band

LWIR | 8 µm – 14 µm

Noise Level (NEdT Value)

Boson+ Professional Grade <30 mK NEdT, Boson+ Industrial Grade <20 mK NEdT

Frame Rate Option

<9 Hz Slow Frame Rate, 60Hz default; 30 Hz runtime selectable

Shutter

No

Solar protection

Yes, lens only

Continuous Digital Zoom

1X to 8X zoom

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Re-writable each frame; alpha blending for translucent overlay

Radiometry

No

Scene Dynamic Range

to 140 °C (high gain)

Temperature Accuracy

—

Field of View

24° HFoV

Focal Length

18mm

Short Lens

Yes

f-number

f/1.0

Dimensions (L x W x H)

21 × 21 × 11 mm without lens

Weight

7.5 g without lens (configuration dependent)

Precision Mounting Holes

Four tapped M1.6×0.35 (rear cover). Lens support recommended when lens mass exceeds core mass.

Input Voltage

3.3 VDC

Power Dissipation

Varies by configuration. 320+ as low as 500 mW, 640+ as low as 1000 mW

Video Channels

CMOS, MIPI or USB3

Control Channels

UART, USB or I2C

Configurable GPIO

Up to 11; user configurable

Operating Temperature Range

-40°C to 80°C

Non-Op. Temp. Range

-50 °C to 85 °C (-58 °F to 185 °F)

Shock

1, 500 g @ 0.4 msec

Operational Altitude

12 km (max altitude of a commercial airliner or airborne platform)

Boson Enclosure Compatible

Yes

IDD CAD Data Boson 640S - 18.0mm-f1.1

This IDD CAD Data package includes a comprehensive set of design resources, featuring a .STEP file and an accompanying PDF. The .STEP file provides a detailed 3D model that ensures compatibility with various CAD software, facilitating seamless integration into your projects. The PDF offers essential documentation, including specifications, dimensions, and guidelines to help you make the most of the provided CAD data. Download the zip file to access these valuable resources for your design and engineering needs.

Download

Teledyne FLIR Boson Plus Datasheet

Download

Boson Family Brochure

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