Teledyne FLIR BOSON+ 640 x 512 36mm 12° HFoV - LWIR Thermal Camera Core

$6,372.00

• Resolution: 640×512 – 12° HFoV
• 12 µm pixel pitch VOx microbolometer
• 21 x 21 x 11 mm, (4.9 cm3 ) camera body
• Weight as low as 7.5 grams
• Low power consumption, starting at 500 mW
• Rugged construction and highest temperature rating -40°C to +80°C

Professional Grade <30mK NEDT – SKU: 22640A012-6PAAX $6372.00
Industrial Grade <20mK NEDT – SKU: 22640A012-6IAAX $7646.00

Interfaces and Accessories sold separately.

We usually have a majority of these items in stock. Please call or contact us for availability.

SKU: 22640A012-6PAAX
boson-p_640_36mm_hero

$6,372.00

$6,372.00

Description
Specifications
Downloads

FLIR Boson+ 36mm Lens

High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module

The Boson longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.

With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.


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DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE

A full-featured VGA thermal camera module at less than 4.9cm3.

  • 21 x 21 x 11 mm camera body and weight as low as 7.5g.
  • Low power consumption, starting at 500 mW
  • 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
  • Rugged construction and -40 °C to 80 °C.
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POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE

FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.

  • Embedded noise filters, gain control, blending, and more.
  • Software-customizable processing and power options.
  • Built-in support for interface standards.
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WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET

Unprecedented integration flexibility for fast, affordable developments.

  • Custom applications via third-party developers.
  • Mechanical/electrical compatibility across versions.
  • OEM integration flexibility.

Resolution

640 x 512

Pixel Pitch

12 µm

Spectral Band

LWIR | 8 µm – 14 µm

Noise Level (NEdT Value)

Boson+ Professional Grade <30 mK NEdT, Boson+ Industrial Grade <20 mK NEdT

Frame Rate Option

60Hz default; 30 Hz runtime selectable

Shutter

Yes

Solar protection

Yes, lens only

Continuous Digital Zoom

1X to 8X zoom

Symbology

Re-writable each frame; alpha blending for translucent overlay

Radiometry

No

Scene Dynamic Range

to 140 °C (high gain)

Temperature Accuracy

Field of View

8° HFoV

Focal Length

36mm

Short Lens

No

f-number

f/1.0

Dimensions (L x W x H)

21 × 21 × 11 mm without lens

Weight

7.5 g without lens (configuration dependent)

Precision Mounting Holes

Four tapped M1.6×0.35 (rear cover). Lens support recommended when lens mass exceeds core mass.

Input Voltage

3.3 VDC

Power Dissipation

Varies by configuration. 320+ as low as 500 mW, 640+ as low as 1000 mW

Video Channels

CMOS, MIPI or USB3

Control Channels

UART, USB or I2C

Configurable GPIO

Up to 11; user configurable

Operating Temperature Range

-40°C to 80°C

Non-Op. Temp. Range

-50 °C to 85 °C (-58 °F to 185 °F)

Shock

1, 500 g @ 0.4 msec

Operational Altitude

12 km (max altitude of a commercial airliner or airborne platform)

Boson Enclosure Compatible

No

Teledyne FLIR Boson Plus Datasheet

Download

Boson Family Brochure

Download