Teledyne FLIR BOSON+ 640 x 512 14mm 32° HFoV - LWIR Thermal Camera Core

$5,289.00

• Resolution: 640x512
• Shutterless
• 50° HFoV
• 12 µm pixel pitch VOx microbolometer
• Multiple high-performance FOV options
• Multiple levels of sensitivity starting at <40 mK
• 21 x 21 x 11 mm camera body
• Weight as low as 7.5 grams
• Low power consumption, starting at 500 mW
• Rugged construction and highest temperature rating -40 °C to +80 °C




Boson Consumer Grade <60mK NEDT SKU:21640A050-6CAAX - $4231.00
Boson Professional Grade <50mK NEDT SKU:21640A050-6PAAX - $5289.00
Boson Industrial Grade <40mK NEDT SKU:21640A050-6IAAX - $6347.00

Interfaces and Accessories sold separately.

We usually have a majority of these items in stock. Please call or contact us for availability.

SKU: 22640A032-6PAAX
Description
Specifications
Downloads

FLIR Boson+ 14mm Lens

High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module

Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.

Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.

Advanced Performance

ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY

Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.

  • ≤20 mK thermal sensitivity
  • Improved latency for faster decision support
  • 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
  • Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites
Industry Leader

POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE

FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.

  • Low power consumption, starting at 900 mW
  • Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
  • Rugged construction and operating temperature rating of -40 °C to 80 °C
Designed for Integrators

DESIGNED FOR INTEGRATORS

Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.

  • Comprehensive product integration documentation and easy-to-use Boson GUI.
  • Highly qualified Technical Services team available to support integration
  • Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
  • Flexible USB and CMOS or USB and MIPI interface

Resolution

640 x 512

Pixel Pitch

12 µm

Spectral Band

LWIR | 8 µm – 14 µm

Noise Level (NEdT Value

Boson Consumer Grade <60 mK NEdT, Boson Professional Grade <50 mK NEdT, Boson Industrial Grade <40 mK NEdT

Frame Rate Option

<9 Hz Slow Frame Rate, 60Hz default; 30 Hz runtime selectable

Shutter

No

Solar protection

Integral

Continuous Digital Zoom

1X to 8X zoom

Symbology

Re-writable each frame; alpha blending for translucent overlay

Radiometry

No

Scene Dynamic Range

to 140 °C (high gain) to 500 °C (low gain)

Temperature Accuracy

—

Field of View

50° HFoV

Focal Length

8.7mm

Short Lens

No

f-number

f/1.0

Dimensions (L x W x H)

21 × 21 × 11 mm without lens

Weight

7.5 g without lens (configuration dependent)

Precision Mounting Holes

Four tapped M1.6 x 0.35 (rear cover). Lens support recommended when lens mass exceeds core mass.

Input Voltage

3.3 VDC

Power Dissipation

Varies by configuration. 320+ as low as 500 mW, 640+ as low as 1000 mW

Video Channels

CMOS or USB2

Control Channels

UART or USB

Configurable GPIO

Up to 11; user configurable

Operating Temperature Range

-40°C to 80°C

Non-Op. Temp. Range

-50 °C to 85 °C (-58 °F to 185 °F)

Shock

1, 500 g @ 0.4 msec

Operational Altitude

12 km (max altitude of a commercial airliner or airborne platform)

Boson Enclosure Compatible

Yes

IDD CAD Data Boson 640 - 14.0mm-f1.0

This IDD CAD Data package includes a comprehensive set of design resources, featuring a .STEP file and an accompanying PDF. The .STEP file provides a detailed 3D model that ensures compatibility with various CAD software, facilitating seamless integration into your projects. The PDF offers essential documentation, including specifications, dimensions, and guidelines to help you make the most of the provided CAD data. Download the zip file to access these valuable resources for your design and engineering needs.

Download

Teledyne FLIR Boson Plus Datasheet

Download

Boson Family Brochure

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