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42 products
42 products
Teledyne FLIR BOSON 640 x 512 18mm 24° HFoV - Short Lens - Shutterless LWIR Thermal Camera Core
From $4,489.00
Unit price perTeledyne FLIR BOSON 640 x 512 18mm 24° HFoV - Short Lens - Shutterless LWIR Thermal Camera Core
From $4,489.00
Unit price perFLIR Boson - 18mm Lens
Compact Short Lens Shutterless LWIR Thermal Camera
The Boson longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5 g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Teledyne FLIR BOSON 640 x 512 9.2mm 50° HFoV - Short Lens LWIR Thermal Camera Core
From $4,489.00
Unit price perTeledyne FLIR BOSON 640 x 512 9.2mm 50° HFoV - Short Lens LWIR Thermal Camera Core
From $4,489.00
Unit price perFLIR Boson 9.2mm Lens
Compact LWIR Thermal Camera
The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Teledyne FLIR BOSON 640 x 512 9.2mm 50° HFoV - Short Lens - Radiometric LWIR Thermal Camera Core
From $4,592.00
Unit price perTeledyne FLIR BOSON 640 x 512 9.2mm 50° HFoV - Short Lens - Radiometric LWIR Thermal Camera Core
From $4,592.00
Unit price perFLIR Boson - 9.2mm Short Lens
Compact LWIR Radiometric Thermal Camera
The Boson longwave infrared (LWIR) radiometric thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
Your Application, Now With Radiometry.
Why Radiometry?
There are times when a simple thermal image is not enough to interpret a scene. In these scenarios, the ability to detect and record the temperature data from every pixel is vital to the task at hand. Radiometric thermal cameras measure the intensity of infrared signals reaching the camera to provide an accurate temperature reading of objects in the scene.
Built-In Spot Meter Accuracy
Boson Radiometric cameras include a Spot Meter Accuracy software feature that provides an assessment of how accurate a given temperature measurement appears in the scene. Available as telemetry data accessed through the Boson SDK or the Boson graphical user interface (GUI), this feature provides guidance across five confidence grades, offering in-the-moment assessment to help improve temperature measurement confidence.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and highest temperature rating -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Includes embedded algorithms for noise filters, gain control, blending, and more.
- Software-customizable functionality for video processing and power dissipation requirements.
- Built-in support for physical and protocol-level interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Customized applications through FLIR-trusted third party developers.
- Mechanical/electrical compatibility across all versions.
- Variety of hardware and image processing integration to fit OEM requirements.
Teledyne FLIR BOSON 640 x 512 24.4mm 18° HFoV - LWIR Thermal Camera Core
From $4,642.00
Unit price perTeledyne FLIR BOSON 640 x 512 24.4mm 18° HFoV - LWIR Thermal Camera Core
From $4,642.00
Unit price perFLIR Boson - 24.4mm Lens
Compact LWIR Thermal Camera
The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Teledyne FLIR BOSON 640 x 512 24.4mm 18° HFoV - Radiometric LWIR Thermal Camera Core
From $4,755.00
Unit price perTeledyne FLIR BOSON 640 x 512 24.4mm 18° HFoV - Radiometric LWIR Thermal Camera Core
From $4,755.00
Unit price perFLIR Boson - 24mm Lens
Compact LWIR Radiometric Thermal Camera
The Boson longwave infrared (LWIR) radiometric thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
Your Application, Now With Radiometry.
Why Radiometry?
There are times when a simple thermal image is not enough to interpret a scene. In these scenarios, the ability to detect and record the temperature data from every pixel is vital to the task at hand. Radiometric thermal cameras measure the intensity of infrared signals reaching the camera to provide an accurate temperature reading of objects in the scene.
Built-In Spot Meter Accuracy
Boson Radiometric cameras include a Spot Meter Accuracy software feature that provides an assessment of how accurate a given temperature measurement appears in the scene. Available as telemetry data accessed through the Boson SDK or the Boson graphical user interface (GUI), this feature provides guidance across five confidence grades, offering in-the-moment assessment to help improve temperature measurement confidence.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and highest temperature rating -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Includes embedded algorithms for noise filters, gain control, blending, and more.
- Software-customizable functionality for video processing and power dissipation requirements.
- Built-in support for physical and protocol-level interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Customized applications through FLIR-trusted third party developers.
- Mechanical/electrical compatibility across all versions.
- Variety of hardware and image processing integration to fit OEM requirements.
FLIR Boson - 55mm Lens
Compact LWIR Thermal Camera
The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Teledyne FLIR BOSON 640 x 512 36mm 12° HFoV - LWIR Thermal Camera Core
From $5,097.00
Unit price perTeledyne FLIR BOSON 640 x 512 36mm 12° HFoV - LWIR Thermal Camera Core
From $5,097.00
Unit price perFLIR Boson -36mm Lens
Compact LWIR Thermal Camera
The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Teledyne FLIR BOSON 640 x 512 55mm 8° HFoV - Radiometric LWIR Thermal Camera Core
From $5,200.00
Unit price perTeledyne FLIR BOSON 640 x 512 55mm 8° HFoV - Radiometric LWIR Thermal Camera Core
From $5,200.00
Unit price perFLIR Boson - 55mm Lens
Compact LWIR Radiometric Thermal Camera
The Boson longwave infrared (LWIR) radiometric thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
Your Application, Now With Radiometry.
Why Radiometry?
There are times when a simple thermal image is not enough to interpret a scene. In these scenarios, the ability to detect and record the temperature data from every pixel is vital to the task at hand. Radiometric thermal cameras measure the intensity of infrared signals reaching the camera to provide an accurate temperature reading of objects in the scene.
Built-In Spot Meter Accuracy
Boson Radiometric cameras include a Spot Meter Accuracy software feature that provides an assessment of how accurate a given temperature measurement appears in the scene. Available as telemetry data accessed through the Boson SDK or the Boson graphical user interface (GUI), this feature provides guidance across five confidence grades, offering in-the-moment assessment to help improve temperature measurement confidence.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and highest temperature rating -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Includes embedded algorithms for noise filters, gain control, blending, and more.
- Software-customizable functionality for video processing and power dissipation requirements.
- Built-in support for physical and protocol-level interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Customized applications through FLIR-trusted third party developers.
- Mechanical/electrical compatibility across all versions.
- Variety of hardware and image processing integration to fit OEM requirements.
Teledyne FLIR BOSON 640 x 512 73mm 5.5° HFoV - LWIR Thermal Camera Core
From $5,716.00
Unit price perTeledyne FLIR BOSON 640 x 512 73mm 5.5° HFoV - LWIR Thermal Camera Core
From $5,716.00
Unit price perFLIR Boson - 73mm Lens
Compact LWIR Thermal Camera
The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Teledyne FLIR Boson Lensless + 73mm Lens
Thermal Camera Configuration
RHP International Configuration — Not a Factory-Assembled FLIR Camera
This product is assembled and configured by RHP International using FLIR BOSON components and a 73mm lens. The resulting camera configuration is offered by RHP International and is not a current factory-assembled FLIR 73mm BOSON camera.
The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight
as low as 7.5g. - Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with
320 and 640 resolutions. - Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control,
blending, and more. - Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Teledyne FLIR BOSON 640 x 512 36mm 12° HFoV - Shutterless LWIR Thermal Camera Core
From $6,372.00
Unit price perTeledyne FLIR BOSON 640 x 512 36mm 12° HFoV - Shutterless LWIR Thermal Camera Core
From $6,372.00
Unit price perFLIR Boson - 36mm Lens
Compact LWIR Thermal Camera
The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.
Teledyne FLIR BOSON 640 x 512 55mm 8° HFoV - Shutterless LWIR Thermal Camera Core
From $6,372.00
Unit price perTeledyne FLIR BOSON 640 x 512 55mm 8° HFoV - Shutterless LWIR Thermal Camera Core
From $6,372.00
Unit price perFLIR Boson - 55mm Lens
Compact LWIR Thermal Camera
The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.
- Embedded noise filters, gain control, blending, and more.
- Software-customizable processing and power options.
- Built-in support for interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Custom applications via third-party developers.
- Mechanical/electrical compatibility across versions.
- OEM integration flexibility.