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THERMAL IMAGING{ $store.xMobileNav.close() }, 0)" >
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SECURITY & SURVEILLANCE{ $store.xMobileNav.close() }, 0)" >
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THERMAL CORES{ $store.xMobileNav.close() }, 0)" >
BOARD CAMERAS{ $store.xMobileNav.close() }, 0)" >ENCLOSED CAMERAS{ $store.xMobileNav.close() }, 0)" >ADD-ONS & COMPONENTS{ $store.xMobileNav.close() }, 0)" >PAN TILT SYSTEMS{ $store.xMobileNav.close() }, 0)" > -
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Teledyne FLIR BOSON+ 640 x 512 4.9mm 95° HFoV - Short Lens - Radiometric LWIR Thermal Camera Core
$6,450.00
Unit price / per• Resolution: 640x512 - 95° HFoV
• Radiometric
• Short Lens Version
• 12 µm pixel pitch VOx microbolometer
• 21 x 21 x 11 mm, (4.9 cm3 ) camera body
• 28.13 x 29 x 34.5 mm with lens
• Low power consumption, starting at 500 mW
• Rugged construction and highest temperature rating -40 °C to +80 °C
Professional Grade <30mK NEDT SKU:22640AS95-6PARX - $5393.00
Industrial Grade <20mK NEDT SKU:22640AS95-6IARX - $6450.00
Interfaces and Accessories sold separately.
We usually have a majority of these items in stock. Please call or contact us for availability.
FLIR Boson+ - 4.9mm Short Lens - Radiometric
High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
Your Application, Now With Radiometry.
Why Radiometry?
There are times when a simple thermal image is not enough to interpret a scene. In these scenarios, the ability to detect and record the temperature data from every pixel is vital to the task at hand. Radiometric thermal cameras measure the intensity of infrared signals reaching the camera to provide an accurate temperature reading of objects in the scene.


Built-In Spot Meter Accuracy
Boson Radiometric cameras include a Spot Meter Accuracy software feature that provides an assessment of how accurate a given temperature measurement appears in the scene. Available as telemetry data accessed through the Boson SDK or the Boson graphical user interface (GUI), this feature provides guidance across five confidence grades, offering in-the-moment assessment to help improve temperature measurement confidence.

ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY
Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.
- ≤20 mK thermal sensitivity
- Improved latency for faster decision support
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites

POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Low power consumption, starting at 900 mW
- Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
- Rugged construction and operating temperature rating of -40 °C to 80 °C

DESIGNED FOR INTEGRATORS
Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.
- Comprehensive product integration documentation and easy-to-use Boson GUI.
- Highly qualified Technical Services team available to support integration
- Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
- Flexible USB and CMOS or USB and MIPI interface
Resolution
Pixel Pitch
Spectral Band
Noise Level (NEdT Value)
Frame Rate Option
Shutter
Solar protection
Continuous Digital Zoom
Symbology
Radiometry
Scene Dynamic Range
Temperature Accuracy
Field of View
Focal Length
Short Lens
f-number
Dimensions (L x W x H)
Weight
Precision Mounting Holes
Input Voltage
Power Dissipation
Video Channels
Control Channels
Configurable GPIO
Operating Temperature Range
Non-Op. Temp. Range
Shock
Operational Altitude
Boson Enclosure Compatible
IDD CAD Data Boson 640S - 4.9mm-f1.1
This IDD CAD Data package includes a comprehensive set of design resources, featuring a .STEP file and an accompanying PDF. The .STEP file provides a detailed 3D model that ensures compatibility with various CAD software, facilitating seamless integration into your projects. The PDF offers essential documentation, including specifications, dimensions, and guidelines to help you make the most of the provided CAD data. Download the zip file to access these valuable resources for your design and engineering needs
Teledyne FLIR Boson Plus Datasheet
DownloadBoson Family Brochure
DownloadADDRESS
P.O. Box 4242
Middletown, New York 10941 U.S.A.
Phone: 1-888-919-2263
Outside the U.S.: +1-845-343-4077
Fax: +1-845-343-4299
Hours of Operation:
Monday - Friday 9:00 AM - 5:00 EST
P.O. Box 4242
Middletown, New York 10941 U.S.A.
Phone: 1-888-919-2263
Outside the U.S.: +1-845-343-4077
Fax: +1-845-343-4299
Hours of Operation:
Monday - Friday 9:00 AM - 5:00 EST
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