FLIR BOSON+ Series

Teledyne FLIR BOSON+ 640 x 512 Lensless - LWIR Thermal Camera Core

From $4,448.00

FLIR Boson+ - Lensless Core

High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module

Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.

Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.

ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY

Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.

≤20 mK thermal sensitivity
Improved latency for faster decision support
12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites

POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE

FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.

Low power consumption, starting at 900 mW
Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
Rugged construction and operating temperature rating of -40 °C to 80 °C

DESIGNED FOR INTEGRATORS

Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.

Comprehensive product integration documentation and easy-to-use Boson GUI.
Highly qualified Technical Services team available to support integration
Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
Flexible USB and CMOS or USB and MIPI interface

Teledyne FLIR BOSON+ 640 x 512 Lensless - Shutterless LWIR Thermal Camera Core

From $4,448.00

FLIR Boson+ - Lensless Core

High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module

Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.

Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.

ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY

Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.

≤20 mK thermal sensitivity
Improved latency for faster decision support
12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites

POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE

FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.

Low power consumption, starting at 900 mW
Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
Rugged construction and operating temperature rating of -40 °C to 80 °C

DESIGNED FOR INTEGRATORS

Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.

Comprehensive product integration documentation and easy-to-use Boson GUI.
Highly qualified Technical Services team available to support integration
Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
Flexible USB and CMOS or USB and MIPI interface

Teledyne FLIR BOSON+ 640 x 512 14mm 32° HFoV - LWIR Thermal Camera Core

From $5,289.00

FLIR Boson+ 14mm Lens

High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module

Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.

Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.

ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY

Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.

≤20 mK thermal sensitivity
Improved latency for faster decision support
12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites

POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE

FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.

Low power consumption, starting at 900 mW
Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
Rugged construction and operating temperature rating of -40 °C to 80 °C

DESIGNED FOR INTEGRATORS

Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.

Comprehensive product integration documentation and easy-to-use Boson GUI.
Highly qualified Technical Services team available to support integration
Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
Flexible USB and CMOS or USB and MIPI interface

Teledyne FLIR BOSON+ 640 x 512 18mm 24° HFoV - LWIR Thermal Camera Core

From $5,289.00

FLIR Boson+ 18mm Lens

High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module

Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.

Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.

ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY

Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.

≤20 mK thermal sensitivity
Improved latency for faster decision support
12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites

POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE

FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.

Low power consumption, starting at 900 mW
Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
Rugged construction and operating temperature rating of -40 °C to 80 °C

DESIGNED FOR INTEGRATORS

Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.

Comprehensive product integration documentation and easy-to-use Boson GUI.
Highly qualified Technical Services team available to support integration
Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
Flexible USB and CMOS or USB and MIPI interface

Teledyne FLIR BOSON+ 640 x 512 24mm 18° HFoV - LWIR Thermal Camera Core

From $5,289.00

FLIR Boson+ 24mm Lens

High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module

Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.

Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.

ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY

Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.

≤20 mK thermal sensitivity
Improved latency for faster decision support
12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites

POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE

FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.

Low power consumption, starting at 900 mW
Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
Rugged construction and operating temperature rating of -40 °C to 80 °C

DESIGNED FOR INTEGRATORS

Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.

Comprehensive product integration documentation and easy-to-use Boson GUI.
Highly qualified Technical Services team available to support integration
Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
Flexible USB and CMOS or USB and MIPI interface

Teledyne FLIR BOSON+ 640 x 512 24mm 18° HFoV - Shutterless LWIR Thermal Camera Core

From $5,289.00

FLIR Boson+ 24mm Lens - Shutterless

High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module

Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.

Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.

DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE

A full-featured VGA thermal camera module at less than 4.9cm³.

21 x 21 x 11 mm camera body and weight as low as 7.5g.
Low power consumption, starting at 500 mW
12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
Rugged construction and -40 °C to 80 °C.

POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE

FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.

Embedded noise filters, gain control, blending, and more.
Software-customizable processing and power options.
Built-in support for interface standards.

WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET

Unprecedented integration flexibility for fast, affordable developments.

Custom applications via third-party developers.
Mechanical/electrical compatibility across versions.
OEM integration flexibility.

Teledyne FLIR BOSON+ 640 x 512 4.9mm 95° HFoV - Short Lens - Shutterless LWIR Thermal Camera Core

From $5,289.00

FLIR Boson+ - 4.9mm Short Lens

Compact LWIR Thermal Camera

The Boson longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.

With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.

DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE

A full-featured VGA thermal camera module at less than 4.9cm³.

21 x 21 x 11 mm camera body and weight as low as 7.5g.
Low power consumption, starting at 500 mW
12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
Rugged construction and -40 °C to 80 °C.

POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE

FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.

Embedded noise filters, gain control, blending, and more.
Software-customizable processing and power options.
Built-in support for interface standards.

WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET

Unprecedented integration flexibility for fast, affordable developments.

Custom applications via third-party developers.
Mechanical/electrical compatibility across versions.
OEM integration flexibility.

Teledyne FLIR BOSON+ 640 x 512 14mm 32° HFoV - Shutterless LWIR Thermal Camera Core

From $5,289.00

FLIR Boson+ 14mm Shutterless

High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module

Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.

Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.

ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY

Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.

≤20 mK thermal sensitivity
Improved latency for faster decision support
12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites

POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE

FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.

Low power consumption, starting at 900 mW
Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
Rugged construction and operating temperature rating of -40 °C to 80 °C

DESIGNED FOR INTEGRATORS

Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.

Comprehensive product integration documentation and easy-to-use Boson GUI.
Highly qualified Technical Services team available to support integration
Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
Flexible USB and CMOS or USB and MIPI interface

Teledyne FLIR BOSON+ 640 x 512 4.9mm 95° HFoV - Short Lens - LWIR Thermal Camera Core

From $5,289.00

FLIR Boson+ - 4.9mm Short Lens

High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module

Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.

Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.

ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY

Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.

≤20 mK thermal sensitivity
Improved latency for faster decision support
12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites

POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE

FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.

Low power consumption, starting at 900 mW
Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
Rugged construction and operating temperature rating of -40 °C to 80 °C

DESIGNED FOR INTEGRATORS

Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.

Comprehensive product integration documentation and easy-to-use Boson GUI.
Highly qualified Technical Services team available to support integration
Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
Flexible USB and CMOS or USB and MIPI interface

Teledyne FLIR BOSON+ 640 x 512 18mm 24° HFoV - Shutterless LWIR Thermal Camera Core

From $5,289.00

FLIR Boson+ 18mm Lens Shutterless

High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module

Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.

Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.

DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE

A full-featured VGA thermal camera module at less than 4.9cm³.

21 x 21 x 11 mm camera body and weight as low as 7.5g.
Low power consumption, starting at 500 mW
12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
Rugged construction and -40 °C to 80 °C.

POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE

FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.

Embedded noise filters, gain control, blending, and more.
Software-customizable processing and power options.
Built-in support for interface standards.

WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET

Unprecedented integration flexibility for fast, affordable developments.

Custom applications via third-party developers.
Mechanical/electrical compatibility across versions.
OEM integration flexibility.

Teledyne FLIR BOSON+ 640 x 512 4.9mm 95° HFoV - Short Lens - Radiometric LWIR Thermal Camera Core

From $5,393.00

FLIR Boson+ - 4.9mm Short Lens - Radiometric

High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module

Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.

Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.

Your Application, Now With Radiometry.

Why Radiometry?

There are times when a simple thermal image is not enough to interpret a scene. In these scenarios, the ability to detect and record the temperature data from every pixel is vital to the task at hand. Radiometric thermal cameras measure the intensity of infrared signals reaching the camera to provide an accurate temperature reading of objects in the scene.

Built-In Spot Meter Accuracy

Boson Radiometric cameras include a Spot Meter Accuracy software feature that provides an assessment of how accurate a given temperature measurement appears in the scene. Available as telemetry data accessed through the Boson SDK or the Boson graphical user interface (GUI), this feature provides guidance across five confidence grades, offering in-the-moment assessment to help improve temperature measurement confidence.

ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY

Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.

≤20 mK thermal sensitivity
Improved latency for faster decision support
12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites

POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE

FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.

Low power consumption, starting at 900 mW
Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
Rugged construction and operating temperature rating of -40 °C to 80 °C

DESIGNED FOR INTEGRATORS

Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.

Comprehensive product integration documentation and easy-to-use Boson GUI.
Highly qualified Technical Services team available to support integration
Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
Flexible USB and CMOS or USB and MIPI interface

Teledyne FLIR BOSON+ 640 x 512 24mm 18° HFoV - Radiometric LWIR Thermal Camera Core

From $5,393.00

FLIR Boson+ 24mm Lens Radiometric

High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module

Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.

Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.

Your Application, Now With Radiometry.

Why Radiometry?

There are times when a simple thermal image is not enough to interpret a scene. In these scenarios, the ability to detect and record the temperature data from every pixel is vital to the task at hand. Radiometric thermal cameras measure the intensity of infrared signals reaching the camera to provide an accurate temperature reading of objects in the scene.

Built-In Spot Meter Accuracy

Boson Radiometric cameras include a Spot Meter Accuracy software feature that provides an assessment of how accurate a given temperature measurement appears in the scene. Available as telemetry data accessed through the Boson SDK or the Boson graphical user interface (GUI), this feature provides guidance across five confidence grades, offering in-the-moment assessment to help improve temperature measurement confidence.

ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY

Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.

≤20 mK thermal sensitivity
Improved latency for faster decision support
12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites

POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE

FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.

Low power consumption, starting at 900 mW
Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
Rugged construction and operating temperature rating of -40 °C to 80 °C

DESIGNED FOR INTEGRATORS

Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.

Comprehensive product integration documentation and easy-to-use Boson GUI.
Highly qualified Technical Services team available to support integration
Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
Flexible USB and CMOS or USB and MIPI interface

Teledyne FLIR BOSON+ 640 x 512 18mm 24° HFoV - Short Lens - Shutterless LWIR Thermal Camera Core

From $5,526.00

FLIR Boson+ 18mm Shutterless Short Lens

High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module

Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.

Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.

DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE

A full-featured VGA thermal camera module at less than 4.9cm³.

21 x 21 x 11 mm camera body and weight as low as 7.5g.
Low power consumption, starting at 500 mW
12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
Rugged construction and -40 °C to 80 °C.

POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE

FLIR infrared video processing with embedded industry-standard interfaces empowers advanced analytics.

Embedded noise filters, gain control, blending, and more.
Software-customizable processing and power options.
Built-in support for interface standards.

WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET

Unprecedented integration flexibility for fast, affordable developments.

Custom applications via third-party developers.
Mechanical/electrical compatibility across versions.
OEM integration flexibility.

Teledyne FLIR BOSON+ 640 x 512 18mm 24° HFoV - Short Lens - LWIR Thermal Camera Core

From $5,526.00

FLIR Boson+ 18mm Short Lens

High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module

Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.

Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.

ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY

Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.

≤20 mK thermal sensitivity
Improved latency for faster decision support
12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites

POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE

FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.

Low power consumption, starting at 900 mW
Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
Rugged construction and operating temperature rating of -40 °C to 80 °C

DESIGNED FOR INTEGRATORS

Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.

Comprehensive product integration documentation and easy-to-use Boson GUI.
Highly qualified Technical Services team available to support integration
Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
Flexible USB and CMOS or USB and MIPI interface

Teledyne FLIR BOSON+ 640 x 512 9.2mm 50° HFoV - Short Lens LWIR Thermal Camera Core

From $5,542.00

Teledyne FLIR BOSON+ - 9.2mm Short Lens

High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module

Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.

Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.

ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY

Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.

≤20 mK thermal sensitivity
Improved latency for faster decision support
12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites

POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE

FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.

Low power consumption, starting at 900 mW
Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
Rugged construction and operating temperature rating of -40 °C to 80 °C

DESIGNED FOR INTEGRATORS

Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.

Comprehensive product integration documentation and easy-to-use Boson GUI.
Highly qualified Technical Services team available to support integration
Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
Flexible USB and CMOS or USB and MIPI interface