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Teledyne FLIR Hadron 640R High Performance, Dual Thermal and Visible OEM Camera Module

Teledyne FLIR Hadron 640R High Performance, Dual Thermal and Visible OEM Camera Module
Highlights:
  • IP54 rated
  • 50mm x 36mm x 43mm (depth)
  • 56 grams
  • 2.9W max power, 1.8W typical power
IR Camera:
  • Radiometric 640 x 512 Boson
  • 13.6mm
  • 32⁰ HFOV
  • MIPI (2-lanes)
  • MIPI, I2C

EO Camera: 

  • 64 MP Sensor
  • 67⁰ HFOV
  • MIPI (4-lanes),
  • MIPI, I2C input
  • Configurable to low-light applications

$3,872.00
  • : Request a Quote
  • SKU: 70640AS32-6PMRXX

Available Options

Teledyne FLIR Hadron™ 640R

High Performance, Dual Thermal and Visible OEM Camera Module

Hadron™ 640R pairs a performance-leading 640x512 resolution radiometric Boson® thermal camera with a 64MP visible camera in a single easy-to-integrate module. With a size, weight, and power (SWaP) optimized design, it is an ideal dual sensor payload for integration into unmanned aircraft systems (UAS), unmanned ground vehicles (UGV), robotic platforms, and AI-ready applications where battery life and run time are mission critical. The Boson longwave infrared (LWIR) thermal camera provides the ability to see through total darkness, smoke, most fog, glare as well as take the temperature of every pixel in the scene. The 64MP visible camera imagery enables AI and machine learning for intelligent sensing applications. With drivers available for market leading processors from NVIDIA, Qualcomm, and more plus industry-leading integration support, Hadron 640R reduces development cost and shortens time to market.



Thermal and Visible Performance

 

INDUSTRY-LEADING THERMAL AND VISIBLE CAMERA PERFORMANCE
Collect high-speed, dual VGA radiometric thermal and HD visible imagery in all light conditions.
  • 64MP visible camera resolution
  • Compact, radiometric, 640x512-resolution Boson provides temperature of every pixel
  • Flexible dual 60 Hz video output via USB or MIPI
Built for Integrators

 

BUILT FOR INTEGRATORS

Reduce development cost and time to market with a solution from a single, reliable supplier.
  • Dual use and classified under US Department of Commerce jurisdiction as ECCN 6A003.b.4.b.
  • Drivers and sample code available for NVIDIA Jetson Nano, Qualcomm RB5, and more
  • Highly qualified, technical services team available to support integration
swap optimized

 

OPTIMIZE DESIGN AND OPERATION TIME WITH COMPACT, LIGHTWEIGHT, AND LOW-POWER MODULE
The performance, reliability and support expected from Teledyne FLIR and the industry’s most versatile HD+ MWIR camera portfolio.
  • Low, steady state power consumption at 1.8W
  • IP54-rated dust and water protection
  • Lightweight 56g enables longer flight time and extends battery life
OVERVIEW
Weight 56g
Dimensions (L x W x H) 35 x 49 x 45 mm
(1.38” x 1.93” x 1.77”)
without lens
CONNECTIONS & COMMUNICATIONS
Software Drivers NVIDIA Jetson Nano
Qualcomm Snapdragon rb5
Qualcomm Snapdragon 865
*Contact Teledyne FLIR for latest software drivers
ELECTRICAL & MECHANICAL
Mechanical Interface Screw mount to back plate
IMAGING & OPTICAL
IR Camera Sensor Boson 640x512 pixels, 12µm pitch, USB 3.0, 2-lane MIPI
IR Camera Video Full resolution @ 60Hz
EO Camera Sensor 9248 x 6944 pixels (64.2 MP), 0.7 µm pitch, 4-lane MIPI
Aspect Ratio Visible: 4 to 3
Thermal 5 to 4
EO Camera Video Full resolution @ 60 Hz
See IMX586 datasheet for more options
IR Camera Optics EFL 13.6mm, 32° HFoV, F/# 1.0
EO Camera Optics Kontatsu B0623D01-0, EFL 4.8 mm, 67° HFOV, F/# 1/2.3
IMU ICM20602, I2C or SPI (selectable)
ENVIRONMENTAL
Operational & Storage Temperature -20 °C to +60 °C
Tested EMI Performance FCC part 15 Class B
Environmental Sealing IP54 (with the rear interfaces sealed)
POWER
Electrical Interface Hirose DF40C-50DP-0.4V (51)
Example of mating connector: DF40HC(2.5)-50DS-0.4V (51)
Power 5V, typical power dissipation <1800 mW, Max <2900 mW
RADIOMETRY
Temperature Accuracy ±5 °C less, over 0 °C to 100 °C range

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