



- High resolution InGaAs 640x512/15µm FPA
- Spectral range: 0.9 – 1.7 μm
- On-chip correlated double sampling (CDS) for noise reduction
- Anti-blooming snapshot integration
- 14-bit CMOS digital video and NTSC/PAL analog video
- Three gain state operating mode for low light applications
- 38 mm x 38 mm x 36 mm
- <81 grams
- <3.2 Watts power (at room temperature)
- >65% quantum efficiency
- Auto Exposure control
- Full suite of FLIR’s advanced image processing modes
- 60 frames per second (60 Hz), 120 Hz in zoom mode
NeDT
NEDT (noise equivalent differential temperature) is the key figure of merit which is used to qualify midwave (MWIR) and longwave (LWIR) infrared cameras. It is a signal-to-noise figure which represents the temperature difference which would produce a signal equal to the camera’s temporal noise. It therefore represents approximately the minimum temperature difference which the camera can resolve. It is calculated by dividing the temporal noise by the response per degree (responsivity) and is usually expressed in units of milliKelvins. The value is a function of the camera’s f/number, its integration time, and the temperature at which the measurement is made.
- : We usually have a majority of these items in stock.
Please call or contact us for availability. - SKU: 43
Tau™ SWIR
SHORTWAVE INFRARED CAMERA CORE
FLIR Tau® SWIR and broadened spectral range Tau Vis-SWIR provides outstanding short-wave infrared image quality and performance over a wide range of imaging and light level conditions. It is the ideal OEM SWIR imaging module for applications like hyperspectral instrumentation, silicon inspection, electro-optical payloads, art restoration, and portable imaging. The Tau SWIR camera incorporates the FLIR high resolution 640×512 ISC1202 Indium Gallium Arsenide (InGaAs) 15-micron pitch focal plane array (FPA) and includes several advanced camera controls features.
PRODUCT CHANGE NOTICE:
The FLIR SWIR sensor used in the Tau SWIR camera is comprised of an InGaAs detector on a silicon Readout IC in a vacuum package assembly. The window on the vacuum package assembly is a high-quality anti-reflection coated glass window. To reduce the impact of possible window defects and debris on the outer window surface, the vacuum package assembly has been modified to move the window further away from the sensor. There are no changes in camera performance with the standard C-mount lenses.
The Vacuum Package Assembly (VPA) Change
From the VPA interface document the original widow height was shown in Figure 1. The taller VPA was created to add window height to the overall assembly. The position of the sensor with respect to the mounting surface did not change. As shown in Figure 1 the distance from the sensor to the front surface of the vacuum window was 0.371 – 0.202 = 0.169. The change shown in Figure 2 changes the distance from the sensor to the front surface of the vacuum window is 0.498 – 0.202 = 0.296.
Sensor to front of window:
was 0.371 – 0.202 = 0.169
is now 0.498 – 0.202 = 0.296.
The increase in package height is small and no changes were made to the internal components of the camera. If the camera is being used with the C-Mount front cover the user should see no difference in performance. There may be some C-Mount lenses which extend well behind the C-Mount standard 17.526mm flange to image plane distance. Adequate distance should be verified before installing any lens to the camera.
High Performance SWIR Camera Core for OEMs
MARKET LEADING FEATURES
With a high resolution InGaAs 640×512/15µm FPA and on-chip correlated double sampling (CDS) for noise reduction Tau SWIR can meet any mission requirements.
SIZE, WEIGHT AND POWER (SWAP) OPTIMIZED
With a compact form factor, light weight (<81 grams), and less than 3.2 W power consumption (at room temperature) Tau SWIR has the SWaP you need.
TECHNICAL PERFORMANCE
Tau SWIR has greater than 65% quantum efficiency and a full suite of FLIR’s advanced image processing modes.
OVERVIEW | |
Spectral Band | SWIR | 0.9 µm – 1.7 µm |
Resolution | 640 x 512 Pixels |
Pixel Pitch | 15 µm |
Detector Type | Indium Gallium Arsenide (InGaAs) |
Weight | <81 grams (w/o optics) |
Dimensions (L x W x H) | 38 x 38 x 36 mm (w/o optics) |
CONNECTIONS & COMMUNICATIONS | |
Discrete I/O Controls Available | Yes |
External Sync Input/Output | Yes |
Primary Camera - TEC | 50-pin Hirose/2-pin Molex |
RS-232 Compatible Communication | 57,600 & 921,600 baud |
Settable Splash Screens | Yes |
User Configurability via SDK & GUI | Yes |
ELECTRICAL & MECHANICAL | |
ESD Protection | Built-In |
IMAGING & OPTICAL | |
Digital Detail Enhancement | Yes |
Full Frame Rate | NTSC: 60 Hz (120 Hz in zoom mode) PAL: 50 Hz (100 Hz in zoom mode) |
Active Area | 9.6 × 7.68 mm |
Invert/Revert | Yes |
Digital Zoom | Yes |
Image Optimization | Yes |
Sensor Technology | Shortwave Infrared (SWIR) Camera Core |
Operability | > 99.5% (Industrial Spec); > 99.0% (Professional Spec); > 98.0% (Consumer Spec) |
NTSC/PAL (field switchable) | Yes |
Polarity Control [black hot & white hot] | Yes |
Optical Fill Factor | 100% |
Symbology | Yes |
Time to Image | <7 sec |
Quantum Efficiency | 1 - 1.5µm: > 65% (Industrial Spec), > 60% (Professional & Consumer Spec) |
ENVIRONMENTAL | |
Humidity | 5 – 95% non-condensing |
Operational Altitude | +12 km |
Shock | 500g @ 0.8 msec |
Vibration | 4.3g three axis |
POWER | |
Input Supply Voltage | 4.9 – 5.5 VDC |
MECHANICAL | |
Precision Mounting Holes | M2 × 0.4 on 4 sides, 2 per side |
Lens Mounts | C-mount |