Boson 320
Available Accessories
The focus-tool accessory, allows any FLIR Boson lens which cannot be focused by hand to be focused by engaging the appropriate slots on the lens barre..
$55.00
Boson Test Board, Detail PCB ASSEMBLY
Boson Development Board
The Development breakout board for Boson users and integrators that need easy access t..
$1,400.00
Camera Link Accessory Kit
For the FLIR Boson Thermal Imaging Cameras
Expansion board for Boson cameras that matches the functionality of the VPC mod..
$499.00
Boson VPC Accessory w/ Analog
For the FLIR Boson Thermal Imaging Cameras
The Boson video/power/control (VPC) is an accessory that adapts the native ..
$170.00
Boson Tripod Mount
The Tripod-mount accessory, provides a means to mount a Boson assembly (or a Boson configured with either the VPC Accessory or t..
$45.00
Boson VPC Accessory
For the FLIR Boson Thermal Imaging Cameras
The Boson video/power/control (VPC) is an accessory that adapts the native high-den..
$150.00
Works with these RHP Boson Interface AssembliesRHP BOSON RC-IF REMOTE CONTROL INTERFACERHP BOSON RC-HD-IF REMOTE CONTROL INTERFACERHP-BOS-DS-IF DUAL T..
$0.00
RHP-BOS-TAU-RB-IF
Boson Tau Replicator Interface
The replicator board adapts the Tau 2 interfaces electronically to make them compatible to ..
$0.00
RHP-BOS-RC-HD-IF
Integrate the Teledyne FLIR Boson into your UAS.
The RHP-BOS-RC-HD-IF allows you to control the Boson camera remotely using a ..
$499.00
RHP-BOS-VPC-TTL-IF
Video Power Communication (VPC) Transistor-Transistor Logic Interface Module
Power Protection
Wit..
$149.00
RHP-BOS-RC-IF
RC-IF Remote Control Interface for the FLIR Boson
Control the Teledyne FLIR BOSON remotely with the "RC-IF" Remote Contr..
$399.00
RHP-BOS-CL-SY-IF Camera Link Module
Converts the Boson Camera to Camera Link and provides Sync access
The RHP-BOS-CL-SY-IF Camera Li..
$399.00
RHP-BOS-VPC-IF - USB3
Video Power Communication Interface
Simple Integration
The Low Profile Boson VPC Inter..
$159.99
RHP-BOS-VPC-IF
Video Power Communication Interface
Simple Integration
The Low Profile Boson VPC Interface Module s..
$129.95
Teledyne FLIR BOSON 320 x 256 13.8mm 16° HFoV - LWIR Thermal Camera Core
- Resolution: 320x256 - 16° HFoV
- 13.8mm Focal Length
- 12 µm pixel pitch VOx microbolometer
- 21 x 21 x 11 mm, (4.9 cm3 ) camera body
- Weight as low as 7.5 grams
- Low power consumption, starting at 500 mW
- Rugged construction and highest temperature rating -40°C to +80°C
- Consumer Grade <60mK - NEDT SKU:20320A016-6CAAX - $1680.00
- Professional Grade <50mK NEDT SKU:20320A016-6PAAX - $2100.00
- Industrial Grade <40mK NEDT SKU:20320A016-6IAAX - $2520.00
Interfaces and Accessories sold separately.
- SKU: 20320A016
$1,680.00
5 or more $1,596.00
FLIR Boson® - 13.8mm Lens
Compact LWIR Thermal Camera
The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5 g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9 cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5 g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and highest temperature rating -40°C to 80°C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Includes embedded algorithms for noise filters, gain control, blending, and more.
- Software-customizable functionality for video processing and power dissipation requirements.
- Built-in support for physical and protocol-level interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Customized applications through FLIR-trusted third party developers.
- Mechanical/electrical compatibility across all versions.
- Variety of hardware and image processing integration to fit OEM requirements.
| OVERVIEW | |||||
| Spectral Band | LWIR | 7.5 µm – 13.5 µm | ||||
| Resolution | 320 × 256 Pixels | ||||
| Sensitivity/NEdT | <40 mK (Industrial) | <50 mK (Professional) | <60 mK (Consumer) | ||||
| Pixel Pitch | 12 µm | ||||
| f-number | 1 | ||||
| Dimensions (L x W x H) | 21 × 21 × 11 mm without lens | ||||
| ELECTRICAL & MECHANICAL | |||||
| Control Channels | UART or USB | ||||
| Peripheral Channels | I2C, SPI, SDIO | ||||
| Video Channels | CMOS or USB2 | ||||
| IMAGING & OPTICAL | |||||
| Full Frame Rate | 60Hz baseline; 30 Hz runtime selectable | ||||
| Image Orientation | Adjustable (vertical flip and/or horizontal flip) | ||||
| Non-Uniformity Correction (NUC) | Factory calibrated; updated FFCs with FLIR’s Silent Shutterless NUC (SSN™) | ||||
| Scene Range [high gain] | to +140 °C (high) | ||||
| Scene Range [low gain] | +500 °C (low) | ||||
| Slow Frame Rate | ≤9 Hz available | ||||
| Snapshots | Full-frame snapshot, SDIO interface to support removable media | ||||
| Solar protection | Integral | ||||
| Sensor Technology | Uncooled VOx microbolometer | ||||
| Symbology | Re-writable each frame; alpha blending for translucent overlay | ||||
| Continuous Digital Zoom | 1X to 8X zoom | ||||
| ENVIRONMENTAL | |||||
| Operational Altitude | 12 km (max altitude of a commercial airliner or airborne platform) | ||||
| Operating Temperature Range | -40°C to 80°C | ||||
| Shock | 1,500 g @ 0.4 msec | ||||
| POWER | |||||
| Input Voltage | 3.3 VDC | ||||
| Power Dissipation | Varies by configuration; as low as 500 mW | ||||
| MECHANICAL | |||||
| Precision Mounting Holes | Four tapped M1.6x0.35 (rear cover). Lens support recommended when lens mass exceeds core mass. | ||||
| INFORMATION | |||||
| DRI |
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