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Teledyne FLIR BOSON+ 640 x 512 8.7mm 50° HFoV - LWIR Thermal Camera Core

END OF LIFE PRODUCT

 

Teledyne FLIR BOSON+ 640 x 512 8.7mm 50° HFoV - LWIR Thermal Camera Core
Teledyne FLIR BOSON+ 640 x 512 8.7mm 50° HFoV - LWIR Thermal Camera Core
Teledyne FLIR BOSON+ 640 x 512 8.7mm 50° HFoV - LWIR Thermal Camera Core
Teledyne FLIR BOSON+ 640 x 512 8.7mm 50° HFoV - LWIR Thermal Camera Core
50° HFoV | 8.7mm Boson+ 640
Teledyne FLIR BOSON+ 640 x 512 8.7mm 50° HFoV - LWIR Thermal Camera Core
Teledyne FLIR BOSON+ 640 x 512 8.7mm 50° HFoV - LWIR Thermal Camera Core
Teledyne FLIR BOSON+ 640 x 512 8.7mm 50° HFoV - LWIR Thermal Camera Core
Teledyne FLIR BOSON+ 640 x 512 8.7mm 50° HFoV - LWIR Thermal Camera Core

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Teledyne FLIR BOSON+ 640 x 512 8.7mm 50° HFoV - LWIR Thermal Camera Core
Highlights:
  • 640x480 resolution
  • 50° HFoV
  • 12 µm pixel pitch VOx microbolometer
  • Multiple high-performance FOV options
  • Multiple levels of sensitivity starting at <40 mK
  • 21 x 21 x 11 mm, (4.9 cm3 ) camera body
  • Weight as low as 7.5 grams
  • Low power consumption, starting at 500 mW
  • Rugged construction and highest temperature rating -40°C to +80°C
  • Professional Grade <30mK NEDT - SKU:22640A050-6PAAX $5460.00
  • Industrial Grade <20mK NEDT - SKU:22640A050-6IAAX $6487.00

Interfaces and Accessories sold separately.

This product has been marked end of life.
The suitable alternative for this product is:
Teledyne FLIR BOSON+ 640 X 512 9.2mm Short Lens 50° HFoV

$5,460.00
  • : We usually have a majority of these items in stock.
    Please call or contact us for availability.
  • SKU: 22640A050

Available Options

FLIR Boson+ 8.7mm Lens

High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module

Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.

 

Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.

hotel_lobby

 

ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY

Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.
  • ≤20 mK thermal sensitivity
  • Improved latency for faster decision support
  • 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
  • Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites
industry-leader

 

POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE

FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
  • Low power consumption, starting at 900 mW
  • Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
  • Rugged construction and operating temperature rating of -40 °C to 80 °C
designed-for-integrators

 

DESIGNED FOR INTEGRATORS

Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.
  • Comprehensive product integration documentation and easy-to-use Boson GUI.
  • Highly qualified Technical Services team available to support integration
  • Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
  • Flexible USB and CMOS or USB and MIPI interface
OVERVIEW
Spectral Band LWIR | 8 µm – 14 µm
Resolution 640 x 512 Pixels
Sensitivity/NEdT <20 mK (Industrial) | <30 mK (Professional)
Pixel Pitch 12 µm
f-number 1.0
Weight 7.5 g without lens (configuration dependent)
Dimensions (L x W x H) 21 × 21 × 11 mm without lens
ELECTRICAL & MECHANICAL
Control Channels UART or USB
Peripheral Channels I2C, SPI, SDIO
Video Channels CMOS or USB2
IMAGING & OPTICAL
Full Frame Rate 60Hz baseline; 30 Hz runtime selectable
Image Orientation Adjustable (vertical flip and/or horizontal flip)
Lens Options 640 x 512 50° HFoV 8.7mm (EFL)
Non-Uniformity Correction (NUC) Factory calibrated
Scene Range [high gain] to +140 °C (high)
Scene Range [low gain] +500 °C (low)
Snapshots Full-frame snapshot, SDIO interface to support removable media
Solar protection Integral
Sensor Technology Uncooled VOx microbolometer
Symbology Re-writable each frame; alpha blending for translucent overlay
Continuous Digital Zoom 1X to 8X zoom
ENVIRONMENTAL
Operational Altitude 12 km (max altitude of a commercial airliner or airborne platform)
Operating Temperature Range -40°C to 80°C
Shock 1,500 g @ 0.4 msec
POWER
Input Voltage 3.3 VDC
Power Dissipation Varies by configuration; as low as 500 mW
MECHANICAL
Precision Mounting Holes Four tapped M1.6x0.35 (rear cover). Lens support recommended when lens mass exceeds core mass.
FLIR Boson 640