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FLIR Tau SWIR 640 x 512 Lensless - Shortwave Infrared Camera



FLIR Tau SWIR 640 x 512 Lensless - Shortwave Infrared Camera
FLIR Tau SWIR 640 x 512 Lensless - Shortwave Infrared Camera
FLIR Tau SWIR 640 x 512 Lensless - Shortwave Infrared Camera
FLIR Tau SWIR 640 x 512 Lensless - Shortwave Infrared Camera
FLIR Tau SWIR 640 x 512 Lensless - Shortwave Infrared Camera
  • High resolution InGaAs 640x512/15µm FPA
  • Spectral range: 0.9 – 1.7 μm
  • On-chip correlated double sampling (CDS) for noise reduction
  • Anti-blooming snapshot integration
  • 14-bit CMOS digital video and NTSC/PAL analog video
  • Three gain state operating mode for low light applications
  • 38 mm x 38 mm x 36 mm
  • <81 grams
  • <3.2 Watts power (at room temperature)
  • >65% quantum efficiency
  • Auto Exposure control
  • Full suite of FLIR’s advanced image processing modes
  • 60 frames per second (60 Hz), 120 Hz in zoom mode
  • Consumer Grade <60mK NEDT SKU: 43-ICAT $19,067.00 
  • Professional Grade <50mK NEDT SKU: 43-IPAT $20,339.00 
  • Industrial Grade <40mK NEDT SKU: 43-IIAT $23,137.00 

Interfaces, Lenses, and Accessories sold separately.

  • : We usually have a majority of these items in stock.
    Please call or contact us for availability.
  • SKU: 43

Available Options



FLIR Tau® SWIR and broadened spectral range Tau Vis-SWIR provides outstanding short-wave infrared image quality and performance over a wide range of imaging and light level conditions. It is the ideal OEM SWIR imaging module for applications like hyperspectral instrumentation, silicon inspection, electro-optical payloads, art restoration, and portable imaging. The Tau SWIR camera incorporates the FLIR high resolution 640×512 ISC1202 Indium Gallium Arsenide (InGaAs) 15-micron pitch focal plane array (FPA) and includes several advanced camera controls features.


The FLIR SWIR sensor used in the Tau SWIR camera is comprised of an InGaAs detector on a silicon Readout IC in a vacuum package assembly. The window on the vacuum package assembly is a high-quality anti-reflection coated glass window. To reduce the impact of possible window defects and debris on the outer window surface, the vacuum package assembly has been modified to move the window further away from the sensor. There are no changes in camera performance with the standard C-mount lenses.

The Vacuum Package Assembly (VPA) Change
From the VPA interface document the original widow height was shown in Figure 1. The taller VPA was created to add window height to the overall assembly. The position of the sensor with respect to the mounting surface did not change. As shown in Figure 1 the distance from the sensor to the front surface of the vacuum window was 0.371 – 0.202 = 0.169. The change shown in Figure 2 changes the distance from the sensor to the front surface of the vacuum window is 0.498 – 0.202 = 0.296.

Sensor to front of window:

was 0.371 – 0.202 = 0.169
is now 0.498 – 0.202 = 0.296.

The increase in package height is small and no changes were made to the internal components of the camera. If the camera is being used with the C-Mount front cover the user should see no difference in performance. There may be some C-Mount lenses which extend well behind the C-Mount standard 17.526mm flange to image plane distance. Adequate distance should be verified before installing any lens to the camera.

High Performance SWIR Camera Core for OEMs

SWIR - Haze Penetration Example


With a high resolution InGaAs 640×512/15µm FPA and on-chip correlated double sampling (CDS) for noise reduction Tau SWIR can meet any mission requirements.

SWIR - Haze Penetration Example


With a compact form factor, light weight (<81 grams), and less than 3.2 W power consumption (at room temperature) Tau SWIR has the SWaP you need.

SWIR - Hidden Layers Example


Tau SWIR has greater than 65% quantum efficiency and a full suite of FLIR’s advanced image processing modes.

SWIR - Silicone Injection Example

SWIR - Agricultural Imaging Example

Spectral Band SWIR | 0.9 µm – 1.7 µm
Resolution 640 x 512 Pixels
Pixel Pitch 15 µm
Detector Type Indium Gallium Arsenide (InGaAs)
Weight <81 grams (w/o optics)
Dimensions (L x W x H) 38 x 38 x 36 mm (w/o optics)
Discrete I/O Controls Available Yes
External Sync Input/Output Yes
Primary Camera - TEC 50-pin Hirose/2-pin Molex
RS-232 Compatible Communication 57,600 & 921,600 baud
Settable Splash Screens Yes
User Configurability via SDK & GUI Yes
ESD Protection Built-In
Digital Detail Enhancement Yes
Full Frame Rate NTSC: 60 Hz (120 Hz in zoom mode) PAL: 50 Hz (100 Hz in zoom mode)
Active Area 9.6 × 7.68 mm
Invert/Revert Yes
Digital Zoom Yes
Image Optimization Yes
Sensor Technology Shortwave Infrared (SWIR) Camera Core
Operability > 99.5% (Industrial Spec); > 99.0% (Professional Spec); > 98.0% (Consumer Spec)
NTSC/PAL (field switchable) Yes
Polarity Control [black hot & white hot] Yes
Optical Fill Factor 100%
Symbology Yes
Time to Image <7 sec
Quantum Efficiency 1 - 1.5µm: > 65% (Industrial Spec), > 60% (Professional & Consumer Spec)
Humidity 5 – 95% non-condensing
Operational Altitude +12 km
Shock 500g @ 0.8 msec
Vibration 4.3g three axis
Input Supply Voltage 4.9 – 5.5 VDC
Precision Mounting Holes M2 × 0.4 on 4 sides, 2 per side
Lens Mounts C-mount
FLIR Boson 640