Teledyne FLIR BOSON+ 640 x 512 4.9mm 95° HFoV – Short Lens – Radiometric LWIR Thermal Camera Core

Price range: $5,230.00 through $6,256.00

Resolution: 640×512 – 95° HFoV
Radiometric
Short Lens Version
12 µm pixel pitch VOx microbolometer
21 x 21 x 11 mm, (4.9 cm³ ) camera body
28.13 x 29 x 34.5 mm with lens
Low power consumption, starting at 500 mW
Rugged construction and highest temperature rating -40 °C to +80 °C

Professional Grade <30mK NEDT SKU:22640AS95-6PARX – $5230.00
Industrial Grade <20mK NEDT SKU:22640AS95-6IARX – $6256.00

_{Interfaces and Accessories sold separately.}

Quantity Discounts Available.
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Quantity	5 +
Price	$4,968.50 - $5,943.20

Noise Level (NEdT Value)

Frame Rate Option

Clear

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SKU: 22640AS95-6xARX Categories: FLIR BOSON+ Series, Thermal Cores, Thermal Imaging Tags: <20mk NEDT, 12µm pixel pitch, 22640AS95-6IARX, 22640AS95-6PARX, 640x512, 95°, boson 1.0, boson 2.0, boson 3.0, Boson 4mm, BOSON® +, FLIR Boson 640, short lens, Teledyne FLIR Brand: Teledyne FLIR

FLIR Boson+ – 4.9mm Short Lens – Radiometric

Compact LWIR Thermal Camera

The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector only comes as 640 x 512 resolution.

The weight of the FLIR Boson 4.3mm including the short lens is 21 ounces. The camera measures (LxWxH) 28.13mm x 29mm x 34.5mm with lens. This Boson represents the smallest footprint.

Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.

DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE

A full-featured VGA thermal camera module at less than 4.9cm³.

21 x 21 x 11 mm camera body and weight as low as 7.5g.
Low power consumption, starting at 500 mW
12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
Rugged construction and highest temperature rating -40 °C to 80 °C.

POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE

FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.

Includes embedded algorithms for noise filters, gain control, blending, and more.
Software-customizable functionality for video processing and power dissipation requirements.
Built-in support for physical and protocol-level interface standards.

WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET

Unprecedented integration flexibility for fast, affordable developments.

Customized applications through FLIR-trusted third party developers.
Mechanical/electrical compatibility across all versions.
Variety of hardware and image processing integration to fit OEM requirements.

Resolution ℹ️	640 x 512
Pixel Pitch ℹ️	12 µm
Spectral Band ℹ️	LWIR \| 8 µm – 14 µm
Noise Level (NEdT Value) ℹ️	Boson+ Professional Grade <30 mK NEdT, Boson+ Industrial Grade <20 mK NEdT
Frame Rate Option ℹ️	60Hz default; 30 Hz runtime selectable
Shutter ℹ️	Yes
Solar protection	Yes, lens only
Continuous Digital Zoom	1X to 8X zoom
Symbology	Re-writable each frame; alpha blending for translucent overlay
Radiometry	Yes
Scene Dynamic Range	to 140 °C (high gain)
Temperature Accuracy	N/A
Field of View ℹ️	95° HFoV
Focal Length ℹ️	4.9mm
Short Lens	Yes
f-number ℹ️	f/1.0
Dimensions (L x W x H)	21 × 21 × 11 mm without lens
Weight	7.5 g without lens (configuration dependent)
Precision Mounting Holes	Four tapped M1.6 x 0.35 (rear cover). Lens support recommended when lens mass exceeds core mass.
Input Voltage	3.3 VDC
Power Dissipation	Varies by configuration. 320+ as low as 500 mW, 640+ as low as 1000 mW
Video Channels	CMOS, MIPI or USB3
Control Channels	UART, USB or I2C
Configurable GPIO	Up to 11; user configurable
Operating Temperature Range	-40°C to 80°C
Non-Op. Temp. Range	-50 °C to 85 °C (-58 °F to 185 °F)
Shock	1, 500 g @ 0.4 msec
Operational Altitude	12 km (max altitude of a commercial airliner or airborne platform)
Boson Enclosure Compatible	Yes

IDD CAD Data Boson 640S - 4.9mm-f1.1

_{This IDD CAD Data package includes a comprehensive set of design resources, featuring a .STEP file and an accompanying PDF. The .STEP file provides a detailed 3D model that ensures compatibility with various CAD software, facilitating seamless integration into your projects. The PDF offers essential documentation, including specifications, dimensions, and guidelines to help you make the most of the provided CAD data. Download the zip file to access these valuable resources for your design and engineering needs.}

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