Teledyne FLIR BOSON 640 x 512 18mm 24° HFoV – Shutterless LWIR Thermal Camera Core
- Resolution: 640×512 – 24° HFoV
- Shutterless
- Short Lens
- 12 µm pixel pitch VOx microbolometer
- 21 x 21 x 11 mm camera body
- Weight as low as 7.5 grams
- Low power consumption, starting at 500 mW
- Rugged construction and highest temperature rating -40°C to +80°C
Boson Consumer Grade <60mK NEDT SKU:21640A024-6CAAX – $4104.00
Boson Professional Grade <50mK NEDT SKU:21640A024-6PAAX – $5130.00
Boson Industrial Grade <40mK NEDT SKU:21640A024-6IAAX – $6156.00
Boson+ Professional Grade<30mK NEDT SKU:23640A024-6PAAX $5130.00
Boson+ Industrial Grade <20mK NEDT SKU:23640A024-6IAAX $6156.00
Interfaces and Accessories sold separately.
$4,104.00 – $6,156.00
This camera is compatible with the Environmental Enclosure for the FLIR Boson.
We usually have a majority of these items in stock.
Please call or contact us for availability.
Description
Specifications
Downloads
Boson+/Boson Comparison
FLIR Boson® – 18mm Lens
Compact Shutterless LWIR Thermal Camera
The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5 g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE A full-featured VGA thermal camera module at less than 4.9 cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5 g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and highest temperature rating -40°C to 80°C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Includes embedded algorithms for noise filters, gain control, blending, and more.
- Software-customizable functionality for video processing and power dissipation requirements.
- Built-in support for physical and protocol-level interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET Unprecedented integration flexibility for fast, affordable developments.
- Customized applications through FLIR-trusted third party developers.
- Mechanical/electrical compatibility across all versions.
- Variety of hardware and image processing integration to fit OEM requirements.
| Resolution | |
|---|---|
| Pixel Pitch | |
| Spectral Band | |
| Noise Level (NEdT Value) |
Boson Consumer Grade <60 mK NEdT, Boson Professional Grade <50 mK NEdT, Boson Industrial Grade <40 mK NEdT, Boson+ Professional Grade <30 mK NEdT, Boson+ Industrial Grade <20 mK NEdT |
| Frame Rate Option |
<9 Hz Slow Frame Rate, 60Hz baseline; 30Hz runtime selectable |
| Shutter | |
| Solar protection | |
| Continuous Digital Zoom | |
| Symbology |
Re-writable each frame; alpha blending for translucent overlay |
| Radiometry | |
| Scene Dynamic Range | |
| Temperature Accuracy | |
| Field of View | |
| Focal Length | |
| Short Lens | |
| f-number | |
| Dimensions (L x W x H) | |
| Weight | |
| Precision Mounting Holes |
Four tapped M1.6×0.35 (rear cover). Lens support recommended when lens mass exceeds core mass. |
| Input Voltage | |
| Power Dissipation |
Varies by configuration. 320+ as low as 500 mW, 640+ as low as 1000 mW |
| Video Channels | |
| Control Channels | |
| Configurable GPIO |
Up to 11; user configurable |
| Operating Temperature Range | |
| Non-Operating Temperature Range | |
| Shock | |
| Operational Altitude |
12 km (max altitude of a commercial airliner or airborne platform) |
| Boson Enclosure Compatible |
- Boson+
- Boson
| Boson Comparison |
Boson+
|
Boson
|
| Resolution | VGA: 640 × 512 | QVGA: 320 × 256 | VGA: 640 × 512 | QVGA: 320 × 256 |
| Pixel Size | 12 μm | 12 μm |
| Spectral Band | 8μm - 14μm | 8μm - 14μm |
| Thermal Sensitivity | Industrial: ≤20 mK | Professional: ≤30 mK | Industrial: ≤40 mK | Professional: ≤50 mK | Consumer: ≤60 mK |
| Video Pipeline & Latency | AGC: Improved with deeper blacks | Latency: <6 ms | AGC: Yes | Latency: <25 ms |
| Scene Dynamic Range | High Gain: up to 150 °C | Low Gain: up to 350 °C | High Gain: <140 °C | Low Gain: <500 °C |
| Frame Rate | 60Hz default; 30 Hz runtime selectable | 60 Hz & 9 Hz |
| Radiometry Option | Yes | Yes |
| Low-Gain Mode Available | Yes | Yes |
| Shutterless Options | Yes | Yes |
| BOSON+ | Boson |
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