Teledyne FLIR BOSON 640 x 512 18mm 24° HFoV – Shutterless LWIR Thermal Camera Core

Price range: $4,104.00 through $6,156.00

  • Resolution: 640×512 – 24° HFoV
  • Shutterless
  • Short Lens
  • 12 µm pixel pitch VOx microbolometer
  • 21 x 21 x 11 mm camera body
  • Weight as low as 7.5 grams
  • Low power consumption, starting at 500 mW
  • Rugged construction and highest temperature rating -40°C to +80°C

 

Boson Consumer Grade <60mK NEDT SKU:21640A024-6CAAX – $4104.00
Boson Professional Grade <50mK NEDT SKU:21640A024-6PAAX – $5130.00
Boson Industrial Grade <40mK NEDT SKU:21640A024-6IAAX – $6156.00

Interfaces and Accessories sold separately.

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Quantity5 +
Price$3,898.80 - $5,848.20

We usually have a majority of these items in stock.
Please call or contact us for availability.

    FLIR Boson® – 18mm Lens

    Compact Shutterless LWIR Thermal Camera

    The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.

    With a weight as low as 7.5 g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.


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    DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE A full-featured VGA thermal camera module at less than 4.9 cm3.

    • 21 x 21 x 11 mm camera body and weight as low as 7.5 g.
    • Low power consumption, starting at 500 mW
    • 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
    • Rugged construction and highest temperature rating -40°C to 80°C.
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    POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.

    • Includes embedded algorithms for noise filters, gain control, blending, and more.
    • Software-customizable functionality for video processing and power dissipation requirements.
    • Built-in support for physical and protocol-level interface standards.
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    WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET Unprecedented integration flexibility for fast, affordable developments.

    • Customized applications through FLIR-trusted third party developers.
    • Mechanical/electrical compatibility across all versions.
    • Variety of hardware and image processing integration to fit OEM requirements.
    Resolution ℹ️

    Pixel Pitch ℹ️

    Spectral Band ℹ️

    Noise Level (NEdT Value) ℹ️

    Boson Consumer Grade <60 mK NEdT, Boson Professional Grade <50 mK NEdT, Boson Industrial Grade <40 mK NEdT

    Frame Rate Option ℹ️

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    Shutter ℹ️

    Solar protection

    Continuous Digital Zoom

    Symbology

    Radiometry

    Scene Dynamic Range

    Temperature Accuracy

    Field of View ℹ️

    Focal Length ℹ️

    Short Lens

    f-number ℹ️

    Dimensions (L x W x H)

    Weight

    Precision Mounting Holes

    Input Voltage

    Power Dissipation

    Video Channels

    Control Channels

    Configurable GPIO

    Up to 11; user configurable

    Operating Temperature Range

    Non-Op. Temp. Range

    Shock

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    Operational Altitude

    Boson Enclosure Compatible

    IDD CAD Data Boson 640SL - 18mm-f1.1

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    Teledyne FLIR Boson Datasheet

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    Boson Family Brochure

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