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FLIR BOSON 640 24.4mm Lens Thermal Imaging Camera

FLIR BOSON 640 24.4mm Lens Thermal Imaging Camera
FLIR BOSON 640 24.4mm Lens Thermal Imaging Camera
FLIR BOSON 640 24.4mm Lens Thermal Imaging Camera
FLIR BOSON 640 24.4mm Lens Thermal Imaging Camera
FLIR BOSON 640 24.4mm Lens Thermal Imaging Camera
FLIR BOSON 640 24.4mm Lens Thermal Imaging Camera
FLIR BOSON 640 24.4mm Lens Thermal Imaging Camera
FLIR BOSON 640 24.4mm Lens Thermal Imaging Camera
FLIR BOSON 640 24.4mm Lens Thermal Imaging Camera
  • Resolution: 640x512 - 18° HFoV
  • 12 µm pixel pitch VOx microbolometer
  • 21 x 21 x 11 mm, (4.9 cm3 ) camera body
  • Weight as low as 7.5 grams
  • Low power consumption, starting at 500 mW
  • Rugged construction and highest temperature rating -40°C to +80°C
  • Consumer Grade <60mK NEDT SKU:20640A018-6CAAX - $3520.00
  • Professional Grade <50mK NEDT SKU:20640A018-6PAAX - $4400.00
  • Industrial Grade <40mK NEDT SKU:20640A018-6IAAX - $5280.00

  • Availability: In Stock
  • SKU: 20640A018
$3,520.00

Available Options

FLIR Boson® - 24.4mm Lens

Compact LWIR Thermal Camera

The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.

With a weight as low as 7.5 g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.


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DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE

A full-featured VGA thermal camera module at less than 4.9 cm3.
  • 21 x 21 x 11 mm camera body and weight as low as 7.5 g.
  • Low power consumption, starting at 500 mW
  • 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
  • Rugged construction and highest temperature rating -40°C to 80°C.
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POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE

FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
  • Includes embedded algorithms for noise filters, gain control, blending, and more.
  • Software-customizable functionality for video processing and power dissipation requirements.
  • Built-in support for physical and protocol-level interface standards.
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WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET

Unprecedented integration flexibility for fast, affordable developments.
  • Customized applications through FLIR-trusted third party developers.
  • Mechanical/electrical compatibility across all versions.
  • Variety of hardware and image processing integration to fit OEM requirements.
OVERVIEW
Spectral Band LWIR | 7.5 µm – 13.5 µm
Resolution 640 x 512 Pixels
Sensitivity/NEdT <40 mK (Industrial) | <50 mK (Professional) | <60 mK (Consumer)
Pixel Pitch 12 µm
f-number 1.0
Weight 7.5 g without lens (configuration dependent)
Dimensions (L x W x H) 21 × 21 × 11 mm without lens
ELECTRICAL & MECHANICAL
Control Channels UART or USB
Peripheral Channels I2C, SPI, SDIO
Video Channels CMOS or USB2
ENVIRONMENTAL
Operational Altitude 12 km (max altitude of a commercial airliner or airborne platform)
Operating Temperature Range -40°C to 80°C
Shock 1,500 g @ 0.4 msec
IMAGING & OPTICAL
Full Frame Rate 60Hz baseline; 30 Hz runtime selectable
Image Orientation Adjustable (vertical flip and/or horizontal flip)
Lens Options 640 x 512 18° HFoV 24mm (EFL)
Non-Uniformity Correction (NUC) Factory calibrated; updated FFCs with FLIR’s Silent Shutterless NUC (SSN™)
Scene Range [high gain] to +140 °C (high)
Scene Range [low gain] +500 °C (low)
Slow Frame Rate ≤9 Hz available
Snapshots Full-frame snapshot, SDIO interface to support removable media
Solar protection Integral
Sensor Technology Uncooled VOx microbolometer
Symbology Re-writable each frame; alpha blending for translucent overlay
Continuous Digital Zoom 1X to 8X zoom
POWER
Input Voltage 3.3 VDC
Power Dissipation Varies by configuration; as low as 500 mW
MECHANICAL
Precision Mounting Holes Four tapped M1.6x0.35 (rear cover). Lens support recommended when lens mass exceeds core mass.
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