Teledyne FLIR Hadron 640R High Performance, Dual Thermal and Visible OEM Camera Module
- IP54 rated
- 50mm x 36mm x 43mm (depth)
- 56 grams
- 2.9W max power, 1.8W typical power
IR Thermal Camera:
- Radiometric 640 x 512 Boson
- 13.6mm
- 32° HFOV
- MIPI (2-lanes)
- MIPI, I2C
EO Visible Camera:
- 64 MP Sensor
- 67° HFOV
- MIPI (4-lanes),
- MIPI, I2C input
- Configurable to low-light applications
Hadron 640R <40mK NEDT SKU:70640AS32–6PMRXX – $3872.00
Hadron+ 640R <20mK NEDT SKU:70640AS32–6PARXP – $4200.00
Hadron+ 640 <20mK NEDT SKU:70640AS32–6PAAXP – $4100.00
Hadron+ 640R <20mK NEDT SKU:70640AS32–6PARXP – $4200.00
Hadron+ 640 <20mK NEDT SKU:70640AS32–6PAAXP – $4100.00
$3,872.00 – $4,200.00
We usually have a majority of these items in stock.
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Description
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Teledyne FLIR Hadron™ 640R
High Performance, Dual Thermal and Visible OEM Camera Module
The ITAR-free Hadron 640 series pairs a 64MP visible camera with a performance-leading 640×512 resolution radiometric Boson® or Boson+ thermal camera in a single easy-to-integrate module. With a size, weight, and power (SWaP) optimized design, it is an ideal dual sensor payload for integration into unmanned aircraft systems (UAS), unmanned ground vehicles (UGV), robotic platforms, and emerging AI applications utilizing Teledyne FLIR Prism™ software.
Hadron 640 models share mechanical and electrical interfaces simplifying design. Compatible with Teledyne FLIR’s Prism AI detection, tracking, and classification models and Prism ISP libraries for super-resolution, turbulence mitigation, contrast enhancement, and more, Hadron 640 series enables effective AI-based applications. With drivers available for market leading processors from NVIDIA®, Qualcomm®, and more plus industry-leading integration support, Hadron 640 also reduces development cost and shortens time to market.
INDUSTRY-LEADING THERMAL AND VISIBLE CAMERA PERFORMANCE
Collect high-speed, dual VGA radiometric thermal and HD visible imagery in all light conditions.
- AI-ready with Teledyne FLIR Prism AI and ISP
- 64MP visible camera resolution
- Flexible dual 60 Hz video output via USB or MIPI
- Available radiometric, 640×512 resolution
Boson+ provides industry leading NEDT of ≤20 mK
BUILT FOR INTEGRATORS
Reduce development cost and time to market with a solution from a single, reliable supplier.
- ITAR-free and classified under US Department of Commerce jurisdiction as ECCN 6A003.b.4.b
- Drivers and sample code available for NVIDIA Jetson Nano, Qualcomm RB5, and more
- Highly qualified, technical services team available to support integration
- Evaluate capabilities with Prism Development Kit for Qualcomm RB5
OPTIMIZE DESIGN AND OPERATION TIME WITH COMPACT, LIGHTWEIGHT, AND LOW-POWER MODULE
The performance, reliability and support expected from Teledyne FLIR and the industry’s most versatile HD+ MWIR camera portfolio.
- Low, steady state power consumption at 1.8W
- IP54-rated dust and water protection
- Lightweight 56g enables longer flight time and extends battery life
- Shared mechanical and electrical interface across all models
| Dimensions | 21 × 21 × 21 in |
|---|---|
| Mechanical Interface | |
| Electrical Interface |
Hadron connector: Hirose DF40C-50DP-0.4V(51) Example of mating connector: DF40HC(2.5)-50DS-0.4V(51) |
| IR Camera Sensor | |
| Power |
5V supply voltage. Typical power dissipation < 1300mW, Max < 2820mW |
| Operational & Storage Temperature | |
| Temperature Accuracy |
±5 °C less, over 0 °C to 100 °C range Non-Radiometric ±5 °C less, over 0 °C to 100 °C range |
| Tested EMI Performance | |
| IR Camera Video | |
| Environmental Sealing | |
| EO Camera Sensor | |
| IR Camera Optics | |
| EO Camera Video | |
| Aspect Ratio |
Visible: 4 to 3 Thermal 5 to 4 Visible: 4 to 3 Thermal 5 to 4 Visible: 4 to 3 Thermal 5 to 4 |
| EO Camera Optics | |
| IMU | |
| Weight | |
| Dimensions (L x W x H) | |
| Sensitivity/NEdT | |
| Radiometric |
