FLIR Boson+ 14mm Lens
Compact LWIR Thermal CameraMade in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators.
Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY
Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.
- ≤20 mK thermal sensitivity
- Improved latency for faster decision support
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Low power consumption, starting at 900 mW
- Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
- Rugged construction and operating temperature rating of -40 °C to 80 °C
DESIGNED FOR INTEGRATORS
Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.
- Comprehensive product integration documentation and easy-to-use Boson GUI.
- Highly qualified Technical Services team available to support integration
- Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
- Flexible USB and CMOS or USB and MIPI interface
|Spectral Band||LWIR | 8 µm – 14 µm|
|Resolution||640 x 512 Pixels|
|Sensitivity/NEdT||<20 mK (Industrial) | <30 mK (Professional)|
|Pixel Pitch||12 µm|
|Weight||7.5 g without lens (configuration dependent)|
|Dimensions (L x W x H)||21 × 21 × 11 mm without lens|
|ELECTRICAL & MECHANICAL|
|Control Channels||UART or USB|
|Peripheral Channels||I2C, SPI, SDIO|
|Video Channels||CMOS or USB2|
|IMAGING & OPTICAL|
|Full Frame Rate||60Hz baseline; 30 Hz runtime selectable|
|Image Orientation||Adjustable (vertical flip and/or horizontal flip)|
|Lens Options||640 x 512 32° HFoV 14mm (EFL)|
|Non-Uniformity Correction (NUC)||Factory calibrated|
|Scene Range [high gain]||to +140 °C (high)|
|Scene Range [low gain]||+500 °C (low)|
|Snapshots||Full-frame snapshot, SDIO interface to support removable media|
|Sensor Technology||Uncooled VOx microbolometer|
|Symbology||Re-writable each frame; alpha blending for translucent overlay|
|Continuous Digital Zoom||1X to 8X zoom|
|Operational Altitude||12 km (max altitude of a commercial airliner or airborne platform)|
|Operating Temperature Range||-40°C to 80°C|
|Shock||1,500 g @ 0.4 msec|
|Input Voltage||3.3 VDC|
|Power Dissipation||Varies by configuration; as low as 500 mW|
|Precision Mounting Holes||Four tapped M1.6x0.35 (rear cover). Lens support recommended when lens mass exceeds core mass.|